ACF laminating method

Abstract

The invention provides an ACF laminating method. The method comprises the following steps of providing a micro light-emitting diode substrate, and arranging a plurality of bonding pads on the micro light-emitting diode substrate in an array; obtaining an ACF pattern, wherein a plurality of ACF units are arranged in the ACF pattern in the array; and attaching the ACF pattern to the micro light-emitting diode substrate, wherein the plurality of ACF units are in one-to-one correspondence with the plurality of bonding pads, and each ACF unit is attached to the corresponding bonding pad. The step of obtaining the ACF pattern comprises the following steps: providing an ACF; and providing punching and adsorption integrated equipment for punching the ACF to obtain the ACF pattern, wherein the punching and adsorption integrated equipment comprises a tool bit and suction nozzle system, the tool bit and suction nozzle system is provided with a plurality of punching cutters in an array mode, and the punching cutters correspond to the ACF units one to one. According to the invention, ACF materials can be saved, a production yield can be improved, the production cost can be reduced, and the invention belongs to the technical field of ACF lamination.

Description

technical field [0001] This application relates to the technical field of ACF lamination, and in particular to an ACF lamination method. Background technique [0002] In recent years, the display industry has developed rapidly, especially in my country, which has undergone earth-shaking changes. Through the introduction of technology, talents, advanced equipment, and innovation of core technologies, my country has become a major display manufacturing country in the world, and the display level has reached the world's leading level. It not only ended the dilemma of few screens in our country, but also led the trend of the display industry. [0003] The competition in the display industry is becoming more and more fierce, and the update cycle is shortening continuously, especially the competition between Liquid Crystal Display (LCD for short) and Organic Light-Emitting Diode (OLED for short). With the maturity of OLED technology and materials and the improvement of yield rat...

AI Technical Summary

Problems solved by technology

like figure 1 , figure 2 As shown, the conventional stamp transfer usually uses the entire surface of the ACF to be attached to the driver backplane, and is bonded to the micro-LED chip by heating and pressing. However, due to the requirements of the micro-LED display technology for ACF It is very high and special. After heating and pressing, the unused ACF in the entire ACF is wasted. Therefore, the entire ACF lamination not only wastes materials and increases costs, but also easily leads to micro - LED panel short circuit, affecting yield

For micro-LED seamless splicing products, due to the entire ACF, it is necessary to use laser equipment to precisely cut the four sides of the ACF unit, which not only increases the process time (tact time) but also increases the cost

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