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Temporary bearing plate, manufacturing method thereof and manufacturing method of packaging substrate

A manufacturing method and carrier board technology are applied in the fields of printed circuit manufacturing, manufacturing of printed circuit precursors, semiconductor/solid-state device manufacturing, etc., which can solve problems such as high cost, limited product design, difficulty in popularization, etc., and reduce broken boards and folded boards. board, avoiding excessive thickness and weight, and simplifying the operation of splitting boards

Active Publication Date: 2021-07-02
NANTONG ACCESS SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the introduction of a heat-resistant film on the copper-clad laminate that can selectively bond the copper-clad laminate without bonding to the subsequent laminated insulating layer, this heat-resistant film cannot directly be used as an embedded circuit because the insulating layer is directly laminated. The product design is limited, and due to the need for a whole new set of equipment and supporting agents, the cost is high and it is difficult to popularize

Method used

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  • Temporary bearing plate, manufacturing method thereof and manufacturing method of packaging substrate
  • Temporary bearing plate, manufacturing method thereof and manufacturing method of packaging substrate
  • Temporary bearing plate, manufacturing method thereof and manufacturing method of packaging substrate

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Embodiment Construction

[0042] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the present disclosure will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0043] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in one or more embodiments of the present specification shall have ordinary meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in one or more embodiments of the present specification do not indicate any order, quantity or importance, but are only used to distinguish different components. "Comprising" or "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items.

[0044] The embodiment of this s...

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Abstract

The embodiment of the invention provides a temporary bearing plate, a manufacturing method of the temporary bearing plate and a manufacturing method of a packaging substrate. Specifically, the temporary bearing plate comprises a first bearing core layer, a first copper foil layer on the first bearing core layer, a second bearing core layer on the first copper foil layer and a second copper foil layer on the second bearing core layer; the first copper foil layer comprises a first outer-layer copper foil and a first inner-layer copper foil which are physically laminated, and the second copper foil layer comprises a second outer-layer copper foil and a second inner-layer copper foil which are physically laminated.

Description

technical field [0001] The embodiments of the present description relate to the field of semiconductor technology, and in particular to a temporary carrier board, a manufacturing method thereof, and a method for manufacturing a package substrate by using the temporary carrier board. Background technique [0002] With the advancement of the trend of miniaturization and portability of electronic systems, the devices of all electronic products today are pursuing lightness, thinness, shortness, and smallness to achieve the most powerful functions with the most limited space occupied. Therefore, the circuit board of the load device It is also required to be thinner and thinner. The traditional circuit board process uses a cored substrate as the circuit board. With the improvement of the circuit board process capability, the thickness of the cored substrate can be achieved, for example, about 0.06mm. However, in the process of manufacturing, the equipment capacity is insufficient ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/14H01L21/48H01L23/31H01L21/56
CPCH01L23/142H01L21/4846H01L23/3121H01L21/56H05K3/007H05K2203/0156H05K1/181H01L21/6835H01L23/538H01L21/568H01L21/52H01L21/78H05K3/025H05K3/064H05K3/4658
Inventor 陈先明冯进东冯磊赵江江宝玥黄本霞洪业杰
Owner NANTONG ACCESS SEMICON CO LTD
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