Adapter plate stacking module, multi-layer module and stacking process

Abstract

The invention provides an adapter plate stacking module. The adapter plate stacking module comprises a base adapter plate and a cap adapter plate; the first surface of the base adapter plate is provided with an RDL and a bonding pad; a cavity is formed in the second surface of the base adapter plate, an RDL and a bonding pad are arranged on the second surface of the base adapter plate, and a bonding pad is arranged at the bottom of the cavity of the base adapter plate; the chip is arranged in the cavity of the base adapter plate; the working surface of the chip is electrically connected with the RDL on the second surface of the base adapter plate; the RDL on the second surface of the base adapter plate is connected with a bonding pad arranged on the side surface of the base adapter plate; the first surface of the cap adapter plate is provided with a cavity corresponding to the cavity of the base adapter plate, and the side surface of the cap adapter plate is provided with a bonding pad; the cap adapter plate and the base adapter plate are bonded and stacked in a counterpoint manner; and the side surface bonding pad of the cap adapter plate is connected with the side surface bonding pad of the base adapter plate through a conductive wire. According to the structure and the process provided by the invention, the adapter plate with larger thickness can be manufactured, and the chip with larger thickness can be borne.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a stacking method of an adapter board. Background technique [0002] Millimeter wave radio frequency technology is developing rapidly in the semiconductor industry. For wireless transmitting and receiving systems, it cannot be integrated into the same chip (SOC). Therefore, it is necessary to integrate different chips including radio frequency units, filters, power amplifiers, etc. into an independent The function of transmitting and receiving signals is realized in the system. [0003] However, RF modules often need to paste components of different materials and thicknesses on an adapter board. Some of these components need to be rewired for interconnection, and some need to be interconnected with solder balls on the bottom, which increases the cost of components. device space. In addition, the RF module must be sealed with a top cover. For a chip with a large thickness...

AI Technical Summary

Problems solved by technology

[0003] However, RF modules often need to paste components of different materials and thicknesses on an adapter board. Some of these components need to be rewired for interconnection, and some need to be interconnected with solder balls on the bottom, which increases the cost of components. device space

In addition, the RF module must be sealed with a top cover. For a chip with a large thickness, a deep cavity needs to be made on the top cover, which increases the thickness of the top cover. If the top cover also needs to have TSV It is interconnected to the top of the upper cover, so because of the limited manufacturing process capability of TSV, the upper cover cannot be too thick, and the cavity and TSV of the upper cover cannot be too deep, which affects the chip usage capability of the entire module

Images