Adjustable unbalanced rectangular plane magnetron sputtering cathode

Abstract

The invention discloses an adjustable unbalanced rectangular plane magnetron sputtering cathode. The adjustable unbalanced rectangular plane magnetron sputtering cathode comprises a frame body, wherein a telescopic device is fixedly installed at the bottom in the frame body, a power device is fixedly installed at the upper end of the telescopic device, a storage device is fixedly installed on each of the two sides of the power device, and telescopic rods are fixedly installed at the ends, away from the power device, of the storage devices; a T-shaped rod is fixedly installed at the end, away from each storage device, of each telescopic rod, a sliding groove is formed in the side wall of the frame body, and the T-shaped rods are located in the sliding groove and is in sliding connection with the side wall of the sliding groove. By arranging the power device and the storage device, the horizontal position of a target material can be changed at any time, the situation that the target material is etched unevenly is reduced, the utilization rate of the target material is improved, the waste of the target material is reduced, by arranging the telescopic device, the distance between the target material and an anode can be changed, the etching degree of the target material can be controlled, and great convenience is brought to daily use.

Description

technical field [0001] The invention relates to the technical field of sputtering cathodes, in particular to a rectangular planar magnetron sputtering cathode. Background technique [0002] Coating is to coat a very thin film on the surface to make it wear-resistant, lubricating, conductive, optical, decorative and other functions. As people's pursuit of products is getting higher and higher, more and more objects will be coated on the surface. The most common method of coating is to use a coating machine to coat, and the most used one is sputtering coating, which can be simply understood as using Ions or high-energy laser bombard the target, and the surface components are sputtered out in the form of atomic groups or ions, and finally deposited on the surface of the substrate to form a thin film. [0003] According to the patent number CN209974874U, it is called a rectangular magnetron sputtering cathode with high target utilization rate. Its core component is a magnetic c...

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Problems solved by technology

[0004] However, the equipment cannot move the target freely. When the target surface is etched unevenly, the position cannot be adjusted, which makes the target utilization rate very low, about 20%, which leads to a lot of waste of materials, and the target etching cannot be controlled. degree, the operating space is very limited

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