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Heterostructure heat-conducting filler, preparation method and application thereof, silicone rubber heat-conducting insulating composite material and preparation method of same

A technology of heterogeneous structure and thermally conductive filler, applied in the field of thermally conductive insulating materials, can solve the problems of reducing the insulating properties of materials, weakening the mechanical properties of composite materials, reducing the volume resistance of materials, etc.

Pending Publication Date: 2021-07-09
NORTHWESTERN POLYTECHNICAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, a large number of thermally conductive fillers not only have little effect, but also inevitably weaken the mechanical properties of the composite material, and increase the production cost and process difficulty; moreover, commonly used thermally conductive composite materials need to add more than 60wt% thermally conductive filler, which It will significantly reduce the volume resistance of the material and reduce the insulation performance of the material

Method used

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  • Heterostructure heat-conducting filler, preparation method and application thereof, silicone rubber heat-conducting insulating composite material and preparation method of same

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preparation example Construction

[0022] The invention provides a method for preparing a heat-conducting filler with a heterogeneous structure, comprising the following steps:

[0023] mixing the boron nitride nanosheet dispersion with the gamma-glycidyl etheroxypropyl trimethoxysilanol solution, and performing the first modification to obtain the modified boron nitride nanosheet;

[0024] mixing the aluminum oxide dispersion with the gamma-aminopropyltriethoxysilanol solution to perform a second modification to obtain modified aluminum oxide;

[0025] The modified boron nitride nanosheets, modified aluminum oxide and dispersant are mixed and grafted to obtain a heterostructure thermally conductive filler.

[0026] In the present invention, unless otherwise specified, the required preparation materials are commercially available products well known to those skilled in the art.

[0027] In the invention, the boron nitride nano-sheet dispersion liquid is mixed with the gamma-glycidyl etheroxypropyl trimethoxysi...

Embodiment 1

[0064] Disperse 8g of BNNS in 80mL of ethanol, and ultrasonically disperse for 30min to obtain a BNNS dispersion; dissolve 0.8g of GPTMS in 20mL of ethanol, ultrasonically for 20min to dissolve evenly, pour the resulting solution into the BNNS dispersion, and heat at 70°C React for 12 hours; after the reaction, centrifuge the obtained material at 3000rmp for 15 minutes, wash the obtained product with ethanol several times until it is clean, and then dry it in vacuum at 60°C for 12 hours to obtain modified BNNS, which is designated as GPTMS-g-BNNS;

[0065] 8gAl 2 o 3 Disperse in 80mL ethanol, ultrasonically disperse for 30min to make it evenly dispersed, and obtain Al 2 o 3 Dispersion liquid: Dissolve 0.8g APTES in 20mL ethanol, sonicate for 20min, pour the resulting solution into Al 2 o 3 In the dispersion liquid, react at 70°C for 12h; after the reaction is completed, centrifuge the obtained material at 3000rmp for 15min, wash the obtained product with ethanol several ti...

Embodiment 2

[0069] Modified BNNS was prepared according to the conditions of Example 1, which was denoted as GPTMS-g-BNNS;

[0070] Prepare modified alumina according to the conditions of Example 1, which is denoted as APTES-g-Al 2 o 3 ;

[0071] The above 1.5g GPTMS-g-BNNS and 3gAPTES-g-Al 2 o 3 Disperse in 100mL ethanol, react at 70°C with a stirring speed of 2500rmp for 12h; after the reaction, centrifuge the obtained material at 3000rmp for 15min, wash the obtained product with ethanol several times until it is clean, and then dry it in vacuum at 60°C 12h, get heterostructure thermal conductive filler BNNS@Al 2 o 3 ;

[0072] 1.5g of the thermally conductive filler BNNS@Al 2 o 3 Add to 3.1g silicone rubber matrix (RTV-2SR), then add 0.25g crosslinking agent (methyltriethoxysilane) and 4g n-hexane, then stir at 60°C for 30min at a speed of 2000rmp, to the obtained Add 0.15g of catalyst (dibutyltin dilaurate) to the mixture, then stir at 60°C for 10min at a speed of 2000rmp, po...

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Abstract

The invention provides a heterostructure heat-conducting filler, a preparation method and application thereof, a silicone rubber heat-conducting insulating composite material and a preparation method thereof, and belongs to the technical field of heat-conducting insulating materials. gamma-glycidyl ether oxypropyl trimethoxy silane (GPTMS) and gamma-aminopropyl triethoxy silane (APTES) are adopted to carry out surface functional modification on boron nitride nanosheets and Al2O3 respectively, so that modified aluminum oxide is grafted to the surfaces of the modified boron nitride nanosheets, and the heat-conducting filler with a'point-surface 'heterostructure is obtained. Compared with a single boron nitride nanosheet layer and aluminum oxide particles, the heat-conducting filler with the point-surface heterostructure can increase the contact lap joint probability of the heat-conducting filler in a silicon rubber matrix, more heat-conducting channels or networks are formed, and the construction efficiency of the heat-conducting channels of the heat-conducting filler in the matrix is improved; therefore, the composite material with high heat-conducting property can be obtained when the use amount of the heat-conducting filler is low, and the mechanical property of the heat-conducting composite material is ensured.

Description

technical field [0001] The invention relates to the technical field of heat-conducting and insulating materials, in particular to a heat-conducting filler with a heterogeneous structure, a preparation method and application thereof, a silicone rubber heat-conducting and insulating composite material and a preparation method thereof. Background technique [0002] Silicone rubber has high flexibility, excellent high and low temperature resistance, corrosion resistance and outstanding electrical insulation performance, which can play the role of sealing, insulation and shock absorption, and is widely used in the preparation of thermal interface materials and other composite materials. However, due to the low thermal conductivity of the silicone rubber body (~0.2W / mK), it cannot meet the needs of high-power, high-density and high-integration electronic components for efficient and rapid conduction / dissipation. In order to meet the increasing conduction / dissipation demand in the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K13/06C08K9/04C08K3/38C08K9/06C08K3/22C08L83/04
CPCC08K13/06C08K9/04C08K3/38C08K9/06C08K3/22C08K2201/011C08K2003/385C08K2003/2227C08L83/04
Inventor 任泽明顾军渭严含阮坤鹏王号
Owner NORTHWESTERN POLYTECHNICAL UNIV
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