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Environment-friendly flame-retardant high-thermal-conductivity metal-based copper-clad plate

A high thermal conductivity, environmentally friendly technology, applied in circuit substrate materials, circuit thermal devices, printed circuits, etc., can solve problems such as reducing the thermal conductivity of metal-based copper clad laminates, improve flame retardancy and flame retardant efficiency, and increase active sites. point, the effect of improving mechanical properties

Active Publication Date: 2021-07-13
深圳市鑫荣进绝缘材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among the metal-based copper-clad laminates widely used in China, the insulating layer is made of glass fiber cloth glued. On the one hand, it is strongly required that the metal-based copper-clad laminate has a high heat dissipation technology development trend; Poor conductors reduce the overall thermal conductivity of metal-based copper clad laminates

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] An environment-friendly flame-retardant metal-based copper-clad laminate with high thermal conductivity, including a circuit layer, a thermally conductive insulating layer, and a metal base layer arranged in sequence from top to bottom, and the thermally conductive insulating layer is calculated by weight, and includes the following components:

[0032] 100 parts of epoxy resin, 30 parts of flame retardant and thermally conductive filler, 6 parts of curing accelerator and 40 parts of curing agent;

[0033] Among them, the flame-retardant and heat-conducting filler is obtained by compounding nano-tungsten ditelluride and copper-chromium-based organic metal frame material.

[0034] Described epoxy resin is the mixture of bisphenol A type epoxy resin, naphthalene ring epoxy resin and biphenyl epoxy resin, the weight ratio of bisphenol A type epoxy resin, naphthalene ring epoxy resin and biphenyl epoxy resin It is 30:10:15.

[0035] The curing agent is methyl tetrahydropht...

Embodiment 2

[0051] An environment-friendly flame-retardant metal-based copper-clad laminate with high thermal conductivity, including a circuit layer, a thermally conductive insulating layer, and a metal base layer arranged in sequence from top to bottom, and the thermally conductive insulating layer is calculated by weight, and includes the following components:

[0052] 100 parts of epoxy resin, 12 parts of flame retardant and thermally conductive filler, 3 parts of curing accelerator and 30 parts of curing agent;

[0053] Among them, the flame-retardant and heat-conducting filler is obtained by compounding nano-tungsten ditelluride and copper-chromium-based organic metal frame material.

[0054] Described epoxy resin is the mixture of bisphenol A type epoxy resin, naphthalene ring epoxy resin and biphenyl epoxy resin, the weight ratio of bisphenol A type epoxy resin, naphthalene ring epoxy resin and biphenyl epoxy resin It is 20:5:5.

[0055] The curing agent is 4,4-diaminodiphenyl su...

Embodiment 3

[0071] An environment-friendly flame-retardant metal-based copper-clad laminate with high thermal conductivity, including a circuit layer, a thermally conductive insulating layer, and a metal base layer arranged in sequence from top to bottom, and the thermally conductive insulating layer is calculated by weight, and includes the following components:

[0072] 100 parts of epoxy resin, 48 parts of flame retardant and thermally conductive filler, 10 parts of curing accelerator and 50 parts of curing agent;

[0073] Among them, the flame-retardant and heat-conducting filler is obtained by compounding nano-tungsten ditelluride and copper-chromium-based organic metal frame material.

[0074] Described epoxy resin is the mixture of bisphenol A type epoxy resin, naphthalene ring epoxy resin and biphenyl epoxy resin, the weight ratio of bisphenol A type epoxy resin, naphthalene ring epoxy resin and biphenyl epoxy resin It is 40:15:20.

[0075] The curing agent is methyl hexahydropht...

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Abstract

The invention discloses an environment-friendly flame-retardant high-thermal-conductivity metal-based copper-clad plate characterized by comprising a circuit layer, a thermal-conductive insulating layer and a metal base layer which are sequentially arranged from top to bottom; the thermal-conductive insulating layer comprises the following components in parts by weight: 100 parts of epoxy resin, 12-48 parts of flame-retardant thermal-conductive filler, 3-10 parts of a curing accelerator and 30-50 parts of a curing agent, wherein the flame-retardant thermal-conductive filler is obtained by compounding nano tungsten ditelluride and a copper-chromium-based organic metal framework material. According to the thermal-conductive insulating layer, epoxy resin serves as a matrix, the flame-retardant thermal-conductive filler is added and serves as a thermal conductive agent and a flame retardant at the same time, and the flame-retardant thermal-conductive filler is obtained by compounding nano tungsten ditelluride and a copper-chromium-based organic metal framework material. The thermal-conductive insulating layer prepared by the invention is different from a traditional halogen flame retardant, is a halogen-free environment-friendly material, and not only has good flame retardance, but also has excellent thermal-conductive property.

Description

technical field [0001] The invention relates to the field of metal-based copper-clad laminates, in particular to an environment-friendly flame-retardant metal-based copper-clad laminate with high thermal conductivity. Background technique [0002] With the rapid development of the printed circuit board industry and the LED industry, the power of electronic products is getting higher and higher, and the placement density is getting higher and higher. How to solve the problems of heat dissipation and structural design has become a huge challenge for today's electronics industry design. Metal-based copper clad laminate is undoubtedly one of the effective means to solve the problem of heat dissipation. Compared with traditional FR-4 and CEM-3 boards, metal-based copper-clad laminates have higher heat dissipation, which makes metal-based copper-clad laminates have excellent heat conduction functions. At the same time, it also has excellent dimensional stability and easy processin...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L87/00C08K3/30C08K9/06C08K9/12H05K1/02H05K1/05
CPCC08L63/00H05K1/0201H05K1/05C08L2205/035C08L2205/025C08L2201/02H05K2201/012C08L87/00C08K3/30C08K9/06C08K9/12
Inventor 何新荣吴国庆江奎魏翠唐剑
Owner 深圳市鑫荣进绝缘材料有限公司