Static pressure applying detection device for detecting strength of chip joint

Abstract

The invention discloses a static pressure applying detection device for detecting the strength of a chip joint, and relates to the technical field of chip detection. The static pressure applying detection device comprises a base, a shell is placed at the top of the base, an extrusion mechanism is fixedly connected to the top of an inner cavity of the shell, and chip seats are clamped to the two sides of the top of the base through clamping mechanisms; the top of the chip seat is integrally connected with a chip cover, and the top of the chip cover is attached to the bottom of the extrusion mechanism. Through the arrangement of an extrusion shovel, after the chip seats are assembled, a working hydraulic rod of a first hydraulic cylinder at the top extends to drive a connecting rod and a limiting cover to move downwards to be attached and extruded with the chip cover, and a second hydraulic cylinder works and shortens to pull a connecting plate to drive a transmission rod to drive a fixed seat and the bottom extrusion shovel to shovel the chip cover and the chip seat on one side; and the second hydraulic cylinder can adjust the static pressure applying strength, so that the shoveling crushing strength can be detected through the pressure sensor in the fixed seat, and the detection strength adaptation to the chip connecting part is remarkably improved.

Description

technical field [0001] The invention relates to the technical field of chip detection, in particular to a detection device for detecting the strength of a joint of a chip by applying static pressure. Background technique [0002] A chip is a semiconductor integrated circuit component product. In today's development of electronic information technology, a chip is the most important basic product. After the chip is produced, it needs to be packaged. In order to ensure the stability of the package, it is necessary to use a detection device for detection. [0003] Chinese patent document CN108106993A discloses an INLAY chip bonding strength test machine, which includes a main body frame and a material tape bonded with an electronic chip; the main body frame is sequentially provided with a driving roller, a swing arm tension adjustment roller group, and The rear driven twisting roller group; the main frame is also equipped with a drive motor to drive the active roller, and a pre...

AI Technical Summary

Problems solved by technology

[0003] Chinese patent document CN108106993A discloses an INLAY chip bonding strength test machine, which includes a main body frame and a material tape bonded with an electronic chip; the main body frame is sequentially provided with a driving roller, a swing arm tension adjustment roller group, and The rear driven twisting roller group; the main frame is also equipped with a drive motor to drive the active roller, and a pressure detection mechanism to detect the pressure of the material belt; The moving twisted roller group and the pressure detection mechanism are connected end to end; the main frame is equipped with a motor controller for controlling the drive motor, a pressure display for displaying the detection data of the pressure detection mechanism, a counter for detecting the number of laps of the material belt, and a counter for detecting the movement of the material belt. The speed detector, and the die-breaking detection mechanism to detect whether the material belt is disconnected; to set and control the material belt running speed, running angle, positive and negative directions, running tension, running time and number of turns, to meet the needs of electronic label production Various material specifications are tested, but in actual use, there are still certain defects: 1. Lack of judging mechanism for strength testing, unable to adapt to the needs of testing in different environments; 2. Lack of component adjustment for clamping mechanisms 3. After testing the chip, it lacks the blocking effect on the chip cover, which leads to easy damage to the chip seat, which leads to an increase in the test cost and cannot be used well. need

Images