Cutting method and cutting device for crystalline silicon

Abstract

The invention discloses a cutting method and a cutting device for crystalline silicon. The cutting method comprises the following steps: placing a silicon rod on a workpiece fixing plate of a cutting machine tool, arranging a conductive plate between the silicon rod and the workpiece fixing plate, starting cutting, and when the conductive plate is cut to a preset position, meanwhile, a signal detection control system obtains that the current of a detection circuit in the conductive plate reaches the preset current, stopping cutting. The cutting device is provided with the cutting machine tool and the conductive plate corresponding to the cutting method, and the cutting method of crystalline silicon is achieved through the cutting device provided by the invention, so that effective cutting of the silicon rod can be guaranteed, and meanwhile, the detection is convenient.

Description

technical field [0001] The invention relates to the technical field of crystalline silicon cutting, in particular to a cutting method and a cutting device capable of automatically identifying the cutting end point of crystalline silicon. Background technique [0002] Crystalline silicon cutting is the use of high-speed moving steel wires to drive abrasives for grinding to achieve the purpose of cutting into silicon wafers. The steel wire is guided by multiple guide wheels to form a wire mesh on the main wire roller, and the silicon rod to be cut is fed by the rising / falling of the worktable to cut into several thin silicon wafers. [0003] In the multi-wire cutting process of crystalline silicon, due to the differences in blade material, silicon block hardness, silicon block impurities, etc., the processing difficulty varies significantly between cutting times. In actual operation, diamond wires, blades, etc. may have weak cutting ability, high hardness of silicon block or ...

AI Technical Summary

Problems solved by technology

In actual operation, diamond wires, blades, etc. may have weak cutting ability, high hardness of silicon block or high impurity content of silicon block. At this time, the difficulty of cutting processing will increase, and the wire bow of steel wire will increase accordingly during the cutting process.

When the wire cutting machine reaches the end point set by the parameters, the cutting depth on both sides of the incoming and outgoing wires has reached the normal value, but at this time there may still be wire bows in the silicon rods, and it is impossible to accurately determine whether the corresponding silicon blocks are cut through. If the silicon block is directly removed from the machine, there will be a risk that the cutting will not be penetrated and some parts will be scrapped. If the silicon block is cut again, there will be a probability that the cut will be too deep and the chip will fall off.

In addition, when the shutdown is restarted, the silicon wafer will be subjected to additional force from the steel wire, and the probability of cracks and abnormal line marks will increase

Images