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Automatic post-curing method of modular intelligent power system

An intelligent power and modular technology, applied in semiconductor/solid-state device manufacturing, laser welding equipment, electrical components, etc., can solve the problems of low processing efficiency and unstable processing quality, and achieve the effect of stable product quality and high processing efficiency

Pending Publication Date: 2021-07-20
广东汇芯半导体有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved in the present invention is that the post-curing processing of the existing modular intelligent power system is completed by manual operation, the processing efficiency is low, and the processing quality is unstable

Method used

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  • Automatic post-curing method of modular intelligent power system
  • Automatic post-curing method of modular intelligent power system
  • Automatic post-curing method of modular intelligent power system

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Embodiment Construction

[0059] It should be noted that, under the condition that there is no conflict in structure or function, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below based on examples.

[0060] The invention proposes an automatic post-curing processing system of a modular intelligent power system.

[0061] The modular intelligent power system structure 10 of the present invention includes:

[0062] circuit board,

[0063] an insulating layer formed on the front surface of the circuit substrate;

[0064] a circuit wiring layer formed on the insulating layer;

[0065] a texture layer, which is formed on the back of the circuit substrate, and is an uneven texture layer;

[0066] Electronic components, which are fixed on the circuit wiring layer;

[0067] Electrical connection structure, electronic components are electrically connected to the circuit wiring layer through th...

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Abstract

The invention relates to an automatic post-curing method of a modular intelligent power system, and belongs to the technical field of power semiconductors. The automatic post-curing method of the modular intelligent power system comprises a first feeding step, a second feeding step, a pressure maintaining step, a baking step, a decompression step, a first discharging step and a second discharging step. According to the automatic post-curing method of the modular intelligent power system, a first carrier, a second carrier and a pressure maintaining assembly are adopted, and the baking conveying device, the conveying track and the mechanical arm are matched, so that at least the steps of automatic feeding, automatic pressurization, automatic baking and automatic discharging can be completed. The post-curing processing efficiency of the modularized intelligent power system structure is high, and the product quality is more stable.

Description

technical field [0001] The invention relates to an automatic post-curing method for a modular intelligent power system, belonging to the technical field of power semiconductors. Background technique [0002] The modular intelligent power system structure, or MIPS (Module Intelligent Power System), is a power drive product that combines power electronics and integrated circuit technology. The modular intelligent power system structure integrates power switching devices and high-voltage drive circuits, and has built-in fault detection circuits such as overvoltage, overcurrent and overheating. On the one hand, the modular intelligent power system structure receives the control signal from the MCU to drive the subsequent circuit to work, and on the other hand, it sends the system status detection signal back to the MCU. Compared with the traditional discrete solution, the modular intelligent power system structure has won an increasing market due to its advantages of high integ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/677B23K26/362
CPCB23K26/362H01L21/67155H01L21/67196H01L21/67706
Inventor 王敏左安超谢荣才
Owner 广东汇芯半导体有限公司
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