Manufacturing method of packaging device based on FlipChipLED chip

Abstract

The invention discloses a manufacturing method of a packaging device based on a FlipChipLED chip, and the method comprises the following steps: 1, chip welding: welding the FlipChipLED chip on a bracket through a die bonder and a reflow oven; 2, packaging and curing: packaging glue mixed with fluorescent powder is poured onto a support through a dispensing machine, and the support is sent into a curing oven to be cured; 3, appearance detection: detecting the appearances of packaging parts on the bracket through a microscope or AOI, and rejecting bad packaging parts, so that the testing and sorting speed is increased, and the abnormal working rate of the packaging parts is reduced; 4, testing and sorting: stripping the packaging parts on the bracket, testing the packaging parts by a light splitting machine, and dividing the packaging parts into packaging parts of a plurality of parameter grades; and 5, packaging and warehousing: after the packaging parts in the graded storage boxes pass through a braiding machine, packaging, and then conveying the packaging parts into a warehouse. The manufacturing method has the characteristics of low welding void rate, good working heat dissipation and difficulty in delamination of packaging glue.

Description

technical field [0001] The invention relates to a manufacturing method of a Flip Chip-based LED chip packaging device, in particular to a manufacturing method of a Flip Chip-based LED chip packaging device with low welding void rate, good work heat dissipation, and packaging glue that is not easy to delaminate. Background technique [0002] The application of Flip Chip LED chips has covered the current application range of formal installations, including lighting, backlighting, automotive, display and other fields. [0003] Development trend: Under the leadership of Flip Chip LED chip flip-chip technology and the planning of high-efficiency and high-power forward-rotation flip-chip solutions, domestic packaging factories follow the development. With the gradual maturity of stand-type flip-chip packaging technology and the continuous decline in costs, But flipping has its own significant performance advantages. [0004] At present, the mainstream Flip Chip LED chips in the m...

AI Technical Summary

Problems solved by technology

[0004] At present, the mainstream Flip Chip LED chips in the market are packaged by eutectic welding, which has high cost and low efficiency; while the low-end soldering method of Flip Chip LED chip packaged devices is solder paste welding, but the voids are large, and the void rate reaches more than 25%. , the welding is unstable; there is also the risk of false welding in the secondary welding. At the same time, the residual flux after solder paste welding will cause blackening and brightness attenuation and dead lights in long-term use

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