SMT surface mounting process for PCBA mainboard processing
A technology of surface mount and motherboard, applied in the direction of assembling printed circuits with electrical components, electrical components, printed circuit manufacturing, etc., can solve the problem of reducing the qualification rate of circuit boards, and achieve the effect of ensuring qualification
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[0027] According to a kind of PCBA main board processing SMT surface chip technique for processing according to the embodiment of the present invention, it is characterized in that, concrete technique is as follows: (1), printing solder paste:
[0028] The solder paste uses eutectic tin-lead alloy: tin 65%; lead 35%. Put the eutectic tin-lead alloy into the solder pot for stirring, and keep abreast of the solder temperature in the solder pot, then put a small amount on the PCBA main board, and start printing presses;
[0029] (2), Component placement:
[0030] Component placement uses an automated placement machine to pick up surface mount components from the feeder and accurately mount them on the printed PCBA board;
[0031] (3) Inspection after component placement:
[0032] After the placement, carefully check whether the placement position has shifted to prevent component wear, placement failure, and bending deformation;
[0033] (4), reflow soldering:
[0034] The fir...
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