SMT surface mounting process for PCBA mainboard processing

A technology of surface mount and motherboard, applied in the direction of assembling printed circuits with electrical components, electrical components, printed circuit manufacturing, etc., can solve the problem of reducing the qualification rate of circuit boards, and achieve the effect of ensuring qualification

Inactive Publication Date: 2021-07-23
深圳市科美通科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, in the process of SMT placement, due to various irregularities, the pass rate of circuit boards is reduced. Therefore, we propose a SMT surface mount process for PCBA motherboard processing to solve this problem.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] According to a kind of PCBA main board processing SMT surface chip technique for processing according to the embodiment of the present invention, it is characterized in that, concrete technique is as follows: (1), printing solder paste:

[0028] The solder paste uses eutectic tin-lead alloy: tin 65%; lead 35%. Put the eutectic tin-lead alloy into the solder pot for stirring, and keep abreast of the solder temperature in the solder pot, then put a small amount on the PCBA main board, and start printing presses;

[0029] (2), Component placement:

[0030] Component placement uses an automated placement machine to pick up surface mount components from the feeder and accurately mount them on the printed PCBA board;

[0031] (3) Inspection after component placement:

[0032] After the placement, carefully check whether the placement position has shifted to prevent component wear, placement failure, and bending deformation;

[0033] (4), reflow soldering:

[0034] The fir...

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PUM

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Abstract

The invention discloses an SMT surface mounting process for PCBA mainboard processing. The SMT surface mounting process specifically comprises the steps of solder paste printing, element mounting, inspection after element mounting, reflow soldering, inspection after reflow soldering, cleaning, performance testing and packaging. According to the SMT surface mounting process for PCBA main board processing, the qualification of the PCBA main board is guaranteed by inspecting, cleaning and testing the surface mounting process, the problem can be found out through inspecting and detecting once the problem occurs in the part, the problem can be solved in time, the phenomenon that a large number of PCBA main board patches are unqualified is prevented, and the process is suitable for application and popularization.

Description

technical field [0001] The invention relates to the technical field of patch technology, in particular to an SMT surface chip technique for PCBA mainboard processing. Background technique [0002] Printed circuit board, also known as printed circuit board, printed circuit board, often uses the English abbreviation PCB, is an important electronic component, a support for electronic components, and a provider of circuit connections for electronic components. It is made by technology, so it is called "printed" circuit board. SMT patch refers to the abbreviation of a series of process processes processed on the basis of PCBA. SMT is surface assembly technology, which is the most popular technology in the electronic assembly industry. And technology, electronic circuit surface assembly technology, called surface mount or surface mount technology, it is a method of mounting non-lead or short lead surface mount components on the surface of printed circuit boards or other substrates...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34
CPCH05K3/341H05K3/3463
Inventor 张延超
Owner 深圳市科美通科技有限公司
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