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Chip cleavage equipment

A chip and equipment technology, applied in the field of chip cleavage equipment, can solve the problems of inaccurate positioning and low precision of lobes, and achieve the effect of high position adjustment accuracy, high precision, and ensuring accuracy and stability

Pending Publication Date: 2021-07-27
精良(北京)电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defects of the equipment in the prior art, which cannot be precisely fixed, and the precision of the lobes is very low, thereby providing a chip cleavage equipment

Method used

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  • Chip cleavage equipment
  • Chip cleavage equipment
  • Chip cleavage equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0099] Such as figure 2 As shown, the stretch film holder 100 is rectangular and has four stretch film tubes 101, the four stretch film tubes 101 constitute the four sides of the stretch film stand 100, and the stretch film tube 101 has a cavity inside;

[0100] Such as image 3 As shown, the adjacent ends of two adjacent stretch film tubes 101 are slidably inserted with a tension angle 102. The tension angle 102 is "L" shaped, and the two ends are suitable for sliding insertion into the stretch film tubes. insertion end 105 within the cavity of 101;

[0101] Such as Figure 4 , 5 As shown, a limit device is set between the tension angle 102 and the stretch film tube 101; the limit device includes a limit groove 103 arranged on the side wall of the stretch film tube 101, and on the tension angle 102 and the limit The slot 103 cooperates with the positioning protrusion 104;

[0102] The specific structure can be that a through hole is provided at the insertion end 105 of ...

Embodiment 2

[0107] A scribing head device 340 provided in this embodiment, such as Figure 7 As shown, the fixed seat 301 is included, and the fixed seat 301 is fixed on the chip cleavage equipment. The fixed seat 301 is provided with a scribing knife through the position control structure 300 and the pressure control structure 400. The scribing knife has a tip for scribing. It is used for dicing on the wafer to facilitate subsequent cleavage.

[0108] Such as Figure 8 As shown, the position control structure 300 includes a first base 302, and the first base 302 is slidably arranged on a fixed base 301 through a sliding platform; on the fixed base 301, an adjustment knob 303 is provided for horizontal rotation, and the adjustment knob 303 has a direction toward the the protruding abutment end of the first base 302;

[0109] Such as Figure 9 As shown, a mounting groove 304 is provided at the bottom of the fixing seat 301, and a third elastic member 305 is installed in the installing g...

Embodiment 3

[0126] The present embodiment provides the split head device 600 for chip 619 cleavage, which is arranged on the chip 619 cleavage equipment; as Figure 18 As shown, it includes: a second base 601, a lifting arm 603 and a driving rod 607; the roller 611 on the lifting arm 603 is pressed on the chip 619 with a scribe line, and the driving device drives the lifting arm 603 to rotate to realize the lifting arm 603 A force is provided to make the roller 611 press down, so that the chip 619 is cracked along the scribe line.

[0127] Such as Figure 19 , 20 As shown, the front end of the second base 601 is provided with a "U"-shaped opening, and a rotating shaft 602 is rotated in the opening, and a lifting arm 603 is sleeved and connected to the rotating shaft 602, so as to realize the rotating connection between the lifting arm 603 and the second base 601;

[0128] Such as Figure 21 , 22 As shown, an abutment plate 604 is provided at one end of the lifting arm 603 close to the...

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Abstract

The invention provides chip cleavage equipment, and belongs to the technical field of chip cleavage. The chip cleavage equipment comprises: a film stretching frame which is used for placing a chip and is connected with a film stretching frame driving device; a cutting-up head device provided with a cutting-up knife for cutting up the chip; a chip splitting head device provided with a roller for splitting the chip, wherein the cutting-up head device and the chip splitting head device are connected with the cutting-up driving device; and a chip splitting supporting device provided with a chip splitting beam for supporting a chip and connected with the chip splitting driving device. The chip splitting supporting device is driven by the chip splitting driving device to be adjusted in the X direction and the Z direction. According to the chip cleavage equipment, through cooperative arrangement of all the devices, the chip cleavage process from the cutting-up knife is achieved, the position adjusting precision is high, accurate point fixing can be achieved, and the chip cleavage precision is high.

Description

technical field [0001] The invention relates to the technical field of chip cleavage, in particular to a chip cleavage device. Background technique [0002] After the crystalline mineral is stressed, the property of crystal cracking into a smooth plane along a certain crystallization direction due to its own structure is called cleavage; the cracked smooth plane is called cleavage plane. Because the cleavage surface is very smooth, the cleavage process is widely used in the fields of semiconductor lasers and optical communications. [0003] In the cleavage process, a dicing device is used to scratch a certain depth of scratches on the wafer, and then use the specific orientation of the wafer to cleavage the plane, and split along the scratches to obtain the required cross-section. [0004] However, in the existing equipment, it is impossible to precisely determine the point, and the accuracy of the lobes is very low. Contents of the invention [0005] Therefore, the tech...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/78B28D5/00B28D5/04B28D7/04
CPCB28D5/0058B28D5/0064B28D5/0082B28D5/04B28D7/005B28D7/04H01L21/67092H01L21/78
Inventor 纪伟任邵彬夏志伟刘严庆
Owner 精良(北京)电子科技有限公司
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