Chip testing device and system and chip testing method

Abstract

The invention provides a chip testing device, a chip testing system and a chip testing method. The chip testing device comprises a testing base and a testing circuit, the testing base is provided with a groove for fixing a to-be-tested packaged chip, the edge of the groove comprises a multi-step structure, the multi-step structure enables the groove to fix the to-be-tested packaged chips with different sizes, and a plurality of step surfaces with different heights of the multi-step structure are respectively provided with a group of conductive contacts; each group of conductive contacts comprises a first conductive contact and a second conductive contact, the first conductive contact and the second conductive contact are electrically connected with the test circuit, =the test circuit is used for sending a test input signal to the to-be-tested packaged chip through the first conductive contact and obtaining a test output signal of the to-be-tested packaged chip through the second conductive contact, and whether the to-be-tested packaging chip is abnormal is determined according to the test output signal. The chip testing device provided by the invention can be compatible with testing of packaged chips with different sizes.

Description

Technical field [0001] The present invention relates to the field of chip technology, and more particularly to a chip test apparatus, a system, and a chip test. Background technique [0002] At present, the integrated circuit chip industry has developed rapidly, and the chip production is also increasing. During the production of integrated circuit chips, the test of chips is very important. After the chip package is completed, the FT (Final Test, Final Test) test is usually required. To ensure the quality of the chip factory, the current chip test device is poorly versatile, and different size package chips requires different chip test devices. Inventive content [0003] Based on the above state, the primary object of the present invention is to provide a method of chip testing apparatus, system, and chip test, which can be compatible with different sizes of packaging chips. [0004] In order to achieve the above object, the technical solution of the present invention provides ...

AI Technical Summary

Problems solved by technology

[0002] At present, the integrated circuit chip industry is developing rapidly, and the chip output is also increasing day by day. In the production process of integrated circuit chips, chip testing is a very important step. After the chip packaging is completed, it usually needs to pass FT (Final Test, final test) test. In order to ensure the quality of the chip when it leaves the factory, however, the current chip testing device is less versatile, and different sizes of packaged chips need to use different chip testing devices

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