Wafer semiconductor product, mask and photoetching machine

Abstract

The invention provides a wafer semiconductor product, a mask and a photoetching machine. The wafer semiconductor product comprises a plurality of tube core exposure fields arranged on the wafer semiconductor product in a dot matrix mode, each tube core exposure field comprises a plurality of tube cores, a plurality of first scribing channels, a plurality of second scribing channels and at least one fine alignment target mark; the plurality of tube cores are arranged in a dot-matrix mode; the first scribing channels are formed between every two adjacent rows of tube cores; the second scribing channels are formed between every two adjacent columns of tube cores; and the fine alignment target mark and the plurality of tube cores are arranged in a non-overlapping mode; and the width of the fine alignment target mark is greater than that of the first scribing channels or the second scribing channels. According to the wafer semiconductor product, the fine alignment target mark is arranged in the area occupied by the tube cores, so that the width of the scribing channels can be reduced under the condition of ensuring alignment, the number of effective tube cores in the tube core exposure fields is further increased, and the cost is saved.

Description

technical field [0001] The invention relates to the technical field of chip manufacturing technology, in particular to a wafer semiconductor product, a mask plate and a photolithography machine. Background technique [0002] Before the chip lithography process of the Ultratech Stepper lithography machine (stepper lithography machine), it is necessary to align the lithography machine with the wafer. The approximate alignment steps are: first, the manipulator rotates the wafer on the wafer on the workbench, align the wafer with the wafer workbench, use the first mask, and perform optical alignment through the Optical Alignment Target Mark (OAT mark) on the first mask (referred to as OAT alignment). The corresponding position on the wafer semiconductor product is an optical alignment field (OAT field), and there are usually two or more OAT fields on a wafer semiconductor product. After the OAT alignment is performed by the calibration system of the lithography machine, a roug...

AI Technical Summary

Problems solved by technology

[0004] Although the above-mentioned die layout structure in the prior art can realize the alignment between the wafer and the mask plate, because it needs to increase the width of the scribing lane, it causes a waste of the wafer area, resulting in a decrease in the number of dies generated. reduction, increased cost

Images