A full-color toning COB light source and method of making the same

A manufacturing method and light source technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems affecting COB chip light emission and leakage, and achieve high reliability, reduce glue overflow, and simple processing technology

Active Publication Date: 2021-11-16
ZHUHAI HONGKE OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of conventional COB light source processing, there are usually the following technical problems: COB chips are generally bonded to the packaging substrate through die-bonding adhesive during COB packaging, but in the actual dispensing process, it is easy to appear due to excessive dispensing. As a result, the die-bonding glue covers the side of the COB chip, which affects the light output of the COB chip. At the same time, the die-bonding glue is generally a conductive silver glue, and it is prone to leakage.

Method used

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  • A full-color toning COB light source and method of making the same
  • A full-color toning COB light source and method of making the same
  • A full-color toning COB light source and method of making the same

Examples

Experimental program
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Effect test

Embodiment 1

[0058] A method for manufacturing a full-color toning COB light source, comprising the following steps:

[0059] (1) Prepare the packaging substrate:

[0060] A. Take the single-sided copper-clad laminate, cut it into a preset size, and set it aside; the single-sided copper-clad laminate includes the single-sided copper-clad laminate substrate 1 and the copper plating layer 2;

[0061] B. Use a brushing machine to remove the oxide film on the surface of the copper clad laminate, coat the positive photoresist 3 on the copper plating layer 2 on the surface of the copper clad laminate, bake and cure, expose the pattern of the solid crystal area through the mask plate, and place it in the developing Develop and etch in the liquid to form several solid crystal regions;

[0062] C. Place the single-sided copper-clad laminate in an ICP etching machine, perform ICP etching on the die-bonding area and form a die-bonding groove, and remove the positive photoresist; the ICP etching dept...

Embodiment 2

[0080] A method for manufacturing a full-color toning COB light source, comprising the following steps:

[0081] (1) Prepare the packaging substrate:

[0082] A. Take the single-sided copper-clad laminate, cut it into preset specifications and sizes, and set aside;

[0083] B. Use a brushing machine to remove the oxide film on the surface of the copper-clad laminate, apply a positive photoresist on the copper-plated layer 2 on the surface of the copper-clad laminate, bake and cure, expose the pattern of the crystal-bonding area through the mask plate, and place it in the developing

[0084] Develop and etch in the liquid to form several solid crystal regions;

[0085] C. Place the single-sided copper-clad laminate in an ICP etching machine, perform ICP etching on the die-bonding area and form a die-bonding groove; remove the positive photoresist; the ICP etching depth is a, and the thickness of the COB chip is b ,

[0086] The thickness of the copper plating layer 2 is c, t...

Embodiment 3

[0104] A method for manufacturing a full-color toning COB light source, comprising the following steps:

[0105] (1) Preparation of packaging substrate:

[0106] A. Take the single-sided copper-clad laminate, cut it into a preset size, and set it aside;

[0107] B. Use a brushing machine to remove the oxide film on the surface of the copper-clad laminate, apply a positive photoresist on the copper-plated layer 2 on the surface of the copper-clad laminate, bake and cure, expose the pattern of the crystal-bonding area through the mask plate, and place it in the developing

[0108] Develop and etch in the liquid to form several solid crystal regions;

[0109] C. Place the single-sided copper-clad laminate in an ICP etching machine, perform ICP etching on the die-bonding area and form a die-bonding groove; remove the positive photoresist; the ICP etching depth is a, and the thickness of the COB chip is b ,

[0110] The thickness of the copper plating layer 2 is c, then c+0.5b=a...

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Abstract

The invention discloses a full-color color-matching COB light source and a manufacturing method thereof, which include a package substrate, a COB chip and a die-bonding adhesive. When preparing the package substrate, the present application creatively sets the original die-bonding area to several horizontal Die-bonding tank, vertical die-bonding tank, horizontal die-bonding tank, the size of the vertical die-bonding tank is consistent with the COB chip to be glued, and there are grooves in the die-bonding tank, after dispensing glue in the crystal-bonding tank , The die-bonding glue can enter the groove, which can greatly reduce the overflow of the glue, and at the same time, the die-bonding glue is not easy to cover the side of the COB chip during bonding, so as to avoid leakage. The COB light source prepared by this application has high light output efficiency and uniform light output. During the preparation process, the side of the COB chip will not be covered with glue, and the crystal-bonding glue will not overflow. The yield and reliability of the COB light source are high, and the luminous effect is excellent. Excellent, more practical.

Description

technical field [0001] The invention relates to the technical field of COB light source processing, in particular to a full-color toned COB light source and a manufacturing method thereof. Background technique [0002] COB light source is a high-efficiency integrated surface light source technology that directly pastes LED chips on a metal substrate. This technology eliminates the concept of brackets, no electroplating, no reflow soldering, and no SMT process, so the process is reduced by nearly one-third and the cost is also reduced. Saved a third. [0003] In the process of conventional COB light source processing, there are usually the following technical problems: COB chips are generally bonded to the packaging substrate through die-bonding adhesive during COB packaging, but in the actual dispensing process, it is easy to appear due to excessive dispensing. As a result, the die-bonding glue covers the side of the COB chip, which affects the light output of the COB chip....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/62
CPCH01L33/48H01L33/483H01L33/62H01L2933/0033H01L2933/0066
Inventor 陈秀莲林建辉黄泽语
Owner ZHUHAI HONGKE OPTOELECTRONICS
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