How to make pcb

A manufacturing method and crimping hole technology, which are applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve the problems of increasing the thickness of the finished PCB, uneven PCB surface, unfavorable insertion and installation of components, etc. The effect of improving the quality, improving the flatness, and reducing the difficulty of production

Active Publication Date: 2022-06-21
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] 1. The low flow prepreg remaining outside the crimp hole area will increase the thickness of the finished PCB;
[0005] 2. High and low steps are formed between the crimping holes and through holes, resulting in uneven surface of the PCB, which is not conducive to the subsequent insertion and installation of components on the PCB, seriously affecting the user experience

Method used

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Embodiment Construction

[0059] In order to describe the technical content, structural features, achieved objects and effects of the present invention in detail, the following detailed description is given in conjunction with the embodiments and the accompanying drawings.

[0060] see Figure 1-Figure 14 As shown, the PCB 100 of the present embodiment is manufactured by a method for manufacturing a partial pressing of the PCB 100 , and the method for manufacturing a partial pressing of the PCB 100 includes the following steps:

[0061] S1. At least one crimping hole area 20 is formed on the sub-board 10 , and each crimping hole area 20 is provided with at least one crimping hole 30 .

[0062] It can be understood that the drawings involved in this embodiment are all illustrated with one of the crimping hole regions 20 of the PCB 100 , and the number of the crimping hole regions 20 of the PCB 100 may be one, two, three or four, etc. . The crimping hole area 20 is provided with a plurality of image ...

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PUM

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Abstract

The invention discloses a PCB manufacturing method and the PCB. The manufacturing method includes: making a crimping hole area on a sub-board; pasting and completely covering the crimping hole area corresponding to the first surface of the sub-board with a spacer; Laser ablation treatment with low-flow prepreg; after lamination of low-flow prepreg on spacer, pre-pressing treatment; removal of spacer and low-flow prepreg pressed on sub-board except for crimping hole area; press plate processing to make a motherboard; make at least one through hole on the motherboard; remove copper foil and low-flow prepreg to make a PCB; the invention can make a PCB with a flat surface and a small thickness, effectively avoiding Low-flow prepregs remain outside the hole area, resulting in the formation of high and low steps on the surface of the crimping hole and through hole of the PCB, which effectively reduces the difficulty of subsequent component insertion and installation on the PCB, and effectively improves the user experience.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), and in particular, to a manufacturing method of the PCB. Background technique [0002] In the prior art, the asymmetric design of the double-sided crimping holes of the PCB is mainly made by the double-sided crimping process of the N+N method. The hole is protected to avoid damage to the crimping hole due to the potion biting the crimping hole in the wet process processing such as potion biting involved in the production of the via hole. [0003] However, when the sub-board is fabricated in the prior art, it is necessary to etch away the outer copper layer of the sub-board except the crimping hole area, only keep the outer layer copper on the sub-board crimping hole area, and press the low-flow prepreg correspondingly. The position of the contact hole area is opened, and then the low-flow prepreg and the whole copper foil board are pressed on the sub-bo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/4611H05K3/0026H05K2203/061
Inventor 刘潭武纪成光王洪府杜红兵王小平陈长平肖璐
Owner DONGGUAN SHENGYI ELECTRONICS
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