High-entropy alloy system high-temperature brazing filler metal

A technology of high-temperature brazing material and high-entropy alloy, applied in metal processing equipment, welding/cutting media/materials, welding equipment, etc., can solve problems such as poor high temperature resistance and large residual stress, and achieve good brazing effect and reliable performance Strong tonality and the effect of relieving residual stress

Pending Publication Date: 2021-08-13
LINYI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to solve the problems of excessive residual stress and poor high temperature

Method used

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  • High-entropy alloy system high-temperature brazing filler metal
  • High-entropy alloy system high-temperature brazing filler metal

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Experimental program
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specific Embodiment approach 1

[0019] Specific implementation mode 1: The chemical formula of a high-entropy alloy-based high-temperature solder in this implementation mode is CoCrFeNiCu x Ti y , CoCrFeNiCu x Ti y The value range of x is 0.5~2, the value range of y is 0.1~0.5, and the molar ratio of Co, Cr, Fe, Ni, Cu and Ti is 1:1:1:1:(0.5~2): (0.1~0.5).

specific Embodiment approach 2

[0020] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the structure of a high-entropy alloy-based high-temperature solder is an fcc structure solid solution. Other steps are the same as in the first embodiment.

specific Embodiment approach 3

[0021] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the yield strength of a high-entropy alloy high-temperature solder is 200MPa-600MPa, and the elongation is greater than 40%. Other steps are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses high-entropy alloy system high-temperature brazing filler metal, and relates to high-temperature brazing filler metal. The problems that a ceramic brazed joint brazed by traditional brazing filler metal has too large residual stress and poor high temperature resistance is solved. The chemical formula of the high-entropy alloy system high-temperature brazing filler metal is CoCrFeNiCuxTiy, the value range of x is 0.5-2, the value range of y is 0.1-0.5, and the molar ratio of Co to Cr to Fe to Ni to Cu to Ti is 1: 1: 1: 1: (0.5-2): (0.1-0.5). A method comprises the following steps of 1, weighing raw materials; and 2, vacuum arc melting. The prepared high-entropy alloy system high-temperature brazing filler metal is used for brazing ceramics and ceramic-based composite materials, the number of fcc solid solution phases in an obtained brazing seam structure is larger, and the residual stress can be effectively relieved through plastic deformation. According to the method, the high-entropy alloy system high-temperature brazing filler metal can be obtained.

Description

technical field [0001] The invention relates to a high-temperature solder. Background technique [0002] Ceramics and ceramic-based composite materials have many advantages such as high temperature resistance, high strength, wear resistance, and low density, and have broad application prospects in the fields of national defense, aerospace, and weaponry. Due to the high hardness and poor processing performance of ceramic materials, it is difficult to manufacture large-sized or complex components. In addition, in many cases, ceramics and ceramic matrix composites need to be connected with metals. Therefore, solving the connection problems of ceramic / ceramic and ceramic / metal is one of the key technologies that must be solved to push high-temperature structural ceramics into applications. [0003] Brazing is currently the most important connection method for ceramic materials. At present, AgCuTi-based brazing material is relatively mature, which is mainly Ag-based and Cu-base...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/32B23K35/14B23K35/40
CPCB23K35/3046B23K35/32B23K35/3053B23K35/3033B23K35/0222B23K35/40
Inventor 章强焦金苗杜玉祥贾德浩付茂青刘梦如
Owner LINYI UNIVERSITY
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