Flip-chip sound time frequency domain and time domain imaging method based on OpenMP
A technology of time-domain imaging and flip-chip welding, which is applied to multi-programming devices, solids using sound waves/ultrasonic waves/infrasonic waves, processor architecture/configuration, etc., and can solve problems such as real-time constraints and the impact of flip-chip welding chip analysis , to achieve the effects of improving efficiency, realizing convenience, and improving imaging efficiency
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[0064] Such as figure 1 Shown is a flip-chip acoustic time-frequency domain and time-domain imaging method based on OpenMP, the method comprises the following steps:
[0065] Step 1. Acquisition of ultrasonic scanning data:
[0066]Step 101, taking the upper left corner of the surface of the flip-chip as the origin, passing the origin and along the long side of the flip-chip as the X-axis direction, passing the origin and along the wide side of the flip-chip as the Y-axis direction, and establishing rectangular coordinates system; wherein, the X-axis and the Y-axis are vertical;
[0067] Step 102, setting the surface of the flip-chip to divide into multiple scanning areas, and the total number of scanning areas is N x ×N y ; where N x Indicates the number of columns of scanning areas formed along the X-axis direction, N y Indicates the number of rows of the scanning area formed along the Y-axis direction, the center position of each scanning area is recorded as the scanni...
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