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Wafer processing method

A processing method, a technology for wafers, applied in the directions of cleaning methods and utensils, chemical instruments and methods, cleaning methods using liquids, etc., which can solve problems such as unsatisfactory

Inactive Publication Date: 2021-08-13
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] While existing semiconductor processing methods are generally adequate for their intended purposes, these semiconductor processing methods are not yet fully satisfactory as they relate to advanced technology nodes

Method used

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  • Wafer processing method
  • Wafer processing method
  • Wafer processing method

Examples

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Embodiment Construction

[0100] The following disclosure provides many different embodiments, or examples, for implementing many different features of the provided subject matter. Specific examples of components and configurations are described below to simplify the present disclosure. These specific examples are, of course, examples only and are not intended to be limiting. For example, forming a first feature over or on a second feature in the ensuing description may include embodiments in which the first and second features are formed in direct contact, and may also include that additional features may be formed between the first feature and the second feature. An embodiment in which the second features are formed such that the first and second features may not be in direct contact. Additionally, the present disclosure may repeat reference numbers and / or letters in various instances. This repetition is for simplicity and clarity only, and does not in itself determine the relationship between the ...

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Abstract

In accordance with some embodiments, a wafer processing method is provided. The wafer processing method includes placing a semiconductor wafer on a wafer stage with a backside surface of the semiconductor wafer facing downwardly. The wafer processing method further includes positioning a first brush assembly below the backside surface of the semiconductor wafer. The wafer processing method also includes moving a first brush assembly toward the backside surface of the semiconductor wafer to a first position. At the first position, an inner brush member and an outer brush member of the first brush assembly, made of different materials, are in contact with the backside surface of the semiconductor wafer. In addition, the wafer processing method includes rotating the first brush assembly relative to the semiconductor wafer while the first brush assembly is in the first position.

Description

technical field [0001] The present disclosure relates to a semiconductor wafer manufacturing system and processing method. Background technique [0002] The semiconductor integrated circuit (IC) industry has experienced exponential growth. Technological advances in IC materials and design have produced generations of ICs, with each generation having smaller and more complex circuits than the previous generation. In the course of IC evolution, while geometric size (ie, the smallest component (or line) that can be produced using a process) has decreased, functional density (ie, the number of interconnected devices per unit of wafer area) has generally increased. Big. This downscaling procedure typically provides benefits by increasing production efficiency and reducing associated costs. This scaling down has also increased the complexity of handling and manufacturing ICs. [0003] As IC technology continues to advance toward smaller features, IC design becomes more challen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02
CPCH01L21/02016H01L21/0201H01L21/0209H01L21/02096H01L21/67046H01L21/67051G03F7/70991B08B1/12B08B1/36B08B3/04
Inventor 麦玄颖李蕙君
Owner TAIWAN SEMICON MFG CO LTD