Vapor chamber structure and manufacturing method thereof
A manufacturing method and vapor chamber technology, which are applied in the construction of electrical equipment components, cooling/ventilation/heating transformation, modification using liquid cooling, etc., can solve the problem of limited shrinkage chamber application range, high production cost, and thermal conductivity materials. Complex layer structure and other issues
Pending Publication Date: 2021-08-13
UNIMICRON TECH CORP
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Problems solved by technology
Since the size and thickness of the vapor chamber are mostly more than 1 mm, it is difficult to place it, for example, in the case of a mobile phone, thereby limiting the application range of the vapor chamber
In addition, because the outer layer of the vapor chamber is made of polymer materials, the heat dissipation coefficients of the polymer material and metal copper are two orders (order), and the structure of the thermally conductive material layer in the chamber is complicated and the production cost is high.
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[0096] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.
[0097] Figure 1A to Figure 1E is a schematic diagram of a manufacturing method of a vapor chamber structure according to an embodiment of the present invention. Figure 2A and Figure 2B respectively Figure 1C The three-dimensional schematic diagram and the top view schematic diagram of the grid structure layer. Figure 2C It is a three-dimensional schematic diagram of a grid structure layer according to another embodiment of the present invention. For the sake of convenience, Figure 1D are shown in partial see-through, while Figure 1E is along Figure 1D A schematic cross-sectional view of the line A-A.
[0098] Regarding the manufacturing method of the vapor chamber structure o...
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Provided are a vapor chamber structure and a manufacturing method thereof. The vapor chamber structure includes a thermally conductive shell, a capillary structure layer, a grid structure layer and a working fluid. The thermally conductive shell is provided with a sealed cavity, and the pressure of the sealed cavity is lower than the standard atmospheric pressure. The capillary structure layer is arranged in the sealed cavity. The grid structure layer is arranged in the sealed cavity and arranged in the first direction. The size of the grid structure layer is smaller than or equal to that of the capillary structure layer. The sealed cavity is filled with the working fluid. The vapor chamber structure has the advantage of being small in thickness, and the manufacturing method of the vapor chamber structure is used for manufacturing the vapor chamber structure and has the advantages of being easy to manufacture, small in thickness, low in cost and the like.
Description
technical field [0001] The invention relates to a heat conduction structure and a manufacturing method thereof, in particular to a vapor chamber structure and a manufacturing method thereof. Background technique [0002] Most of the current vapor chambers are used on the outer edge of electronic systems and between electronic components or circuit boards and heat sinks. Since the size and thickness of the vapor chambers are mostly more than 1 mm, it is difficult to place them in, for example, the casing of a mobile phone, thereby limiting the application range of the vapor chambers. In addition, since the outer layer of the vapor chamber is made of polymer material, the heat dissipation coefficient of the polymer material is two orders different from that of metal copper, and the structure of the thermally conductive material layer inside the vapor chamber is complicated and the manufacturing cost is high. Therefore, how to effectively reduce the thickness of the vapor cham...
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Login to View More IPC IPC(8): H05K7/20
CPCH05K7/20309H05K7/20318H05K7/20336H05K7/2029
Inventor 谭瑞敏林溥如罗正中郭季海柯正达曾子章刘汉诚
Owner UNIMICRON TECH CORP