A processing control system and method based on hexagonal boron nitride composite thermally conductive film
A hexagonal boron nitride and boron nitride film technology, applied in chemical instruments and methods, synthetic resin layered products, instruments, etc., can solve the problems of low yield and low processing efficiency of composite thermal conductive films, and reduce material loss. Quantity, improve position detection accuracy and position detection efficiency, and save processing costs.
Active Publication Date: 2022-01-18
SUZHOU KANRONICS ELECTRONICS TECH CO LTD +1
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[0003] The present invention provides a processing control system and method based on hexagonal boron nitride composite heat-conducting film to solve the problems of low processing efficiency and low yield of the existing composite heat-conducting film. The adopted technical scheme is as follows:
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[0060] The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
[0061] A processing control system based on hexagonal boron nitride composite heat-conducting film proposed in the embodiment of the present invention, such as figure 1 As shown, the processing control system includes:
[0062] The first lamination module is used to detect the position between the double-sided adhesive tape and the hexagonal boron nitride diaphragm. After confirming that the positions of the double-sided adhesive tape and the hexagonal boron nitride diaphragm are aligned, the double-sided adhesive tape is attached to the On both sides of the hexagonal boron nitride diaphragm;
[0063] The second pasting module is used to detect the position betwee...
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The invention proposes a processing control system and method based on a hexagonal boron nitride composite heat-conducting film. The processing control system includes: the first bonding module, which is used to detect the position between the double-sided adhesive tape and the hexagonal boron nitride diaphragm. After confirming the alignment of the double-sided adhesive tape and the hexagonal boron nitride diaphragm, the Glue is attached to the two sides of the hexagonal boron nitride diaphragm; the second bonding module is used for position detection between the hexagonal boron nitride diaphragm and the high-power graphite diaphragm attached with double-sided adhesive, Paste the high-power graphite diaphragm on one side of the hexagonal boron nitride diaphragm; the third bonding module is used to detect the position between the double-sided adhesive and the high-power graphite diaphragm, and determine the double-sided adhesive and high-power After the positions between the graphite diaphragms are aligned, attach the double-sided adhesive to one side of the high-power graphite diaphragm to form the initial composite thermal conduction film; the pressure shear processing module is used for pressure treatment and shearing of the initial composite thermal conduction film After processing, a final composite thermally conductive film is obtained.
Description
technical field [0001] The invention provides a processing control system based on a hexagonal boron nitride composite heat-conducting film, which belongs to the technical field of composite heat-conducting films. Background technique [0002] With the rapid development of the electronics industry, the integration of electronic products continues to increase, the power continues to increase, the volume continues to shrink, the heat generated by the chip also increases significantly, the heat density rises sharply, and the temperature of electronic equipment increases rapidly. There are more and more equipment failures. How to effectively solve the heat dissipation problem during the electronic period has become a key problem to be solved in the development of the entire electronic industry. Composite heat conduction film has become an ideal heat conduction and heat dissipation material for electronic products due to its ultra-high thermal conductivity and good specific heat ...
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IPC IPC(8): B32B37/10B32B37/12B32B38/00B32B38/18B32B9/00B32B9/04B32B27/36G06T7/70
CPCB32B37/1284B32B38/1833B32B38/0004B32B37/10B32B9/00B32B9/007B32B9/04B32B9/045B32B27/36G06T7/70
Inventor 郭志军陈仁政黄国伟张腾吴超明
Owner SUZHOU KANRONICS ELECTRONICS TECH CO LTD