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Reusable method of dummy semiconductor element

A semiconductor and component technology, which is applied in the reusable field of dummy semiconductor components, can solve the problems of semiconductor component consumption and increase production costs, and achieve the effect of reducing production costs

Pending Publication Date: 2021-08-20
SAE TECH DELEVOPMENT DONGGUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In actual production, a large number of dummy semiconductor components are consumed, increasing production costs

Method used

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  • Reusable method of dummy semiconductor element

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0019] see figure 1 , an embodiment of the present invention provides a reusable method for a dummy semiconductor element, which includes the following steps:

[0020] S10, putting the dummy semiconductor element into the airtight chamber;

[0021] S11, vacuumize the chamber;

[0022] Among them, the chamber is connected with the vacuum pump through a vacuum pipeline, and there is a sealing ring at the seam to prevent gas leakage. The chamber is evacuated by a v...

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Abstract

The invention relates to the technical field of semiconductors, and discloses a reusable method of a dummy semiconductor element. The method comprises the following steps: putting the dummy semiconductor element into a closed cavity; vacuumizing the cavity; introducing ammonia gas and silane into the vacuumized cavity, and enabling the pressure intensity in the cavity to reach a preset pressure intensity value; heating the interior of the cavity to make the temperature in the cavity reach a preset temperature value; and after a silicon nitride protective film is formed on the outer surface of the dummy semiconductor element, taking out the dummy semiconductor element from the cavity. According to the invention, the dummy semiconductor element can be repeatedly used so as to reduce the production cost.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a reusable method for dummy semiconductor elements. Background technique [0002] In the semiconductor manufacturing process, ion etching is one of the most commonly used process steps. In the ion etching process, it is necessary to introduce a semiconductor baffle as a dummy semiconductor element, which is usually made of dummy-bars from the corners of the wafer, which can play a role in occupying space. Since the semiconductor finished products do not completely occupy the chamber, several dummy semiconductor elements are introduced as semiconductor baffles, so that the oxidation effect of the semiconductor elements in the chamber and in each batch is consistent. Usually, the semiconductor baffle as a dummy semiconductor element will become thinner with ion etching until it loses its function and needs to be replaced with a new dummy semiconductor element. In actual pr...

Claims

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Application Information

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IPC IPC(8): H01L21/02
CPCH01L21/02032H01L21/0217H01L21/02271
Inventor 刘曙
Owner SAE TECH DELEVOPMENT DONGGUAN
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