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Substrate processing system, substrate chamber for a vacuum processing system, and method of cooling a substrate

A substrate processing system and substrate technology, applied to electrical components, conveyor objects, transportation and packaging, etc., can solve the problem of expensive cooling gas

Pending Publication Date: 2021-08-20
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, chilled gas cooling systems have some disadvantages in terms of cooling efficiency, operating and maintenance costs
For example, commonly used cooling gases such as helium are very expensive

Method used

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  • Substrate processing system, substrate chamber for a vacuum processing system, and method of cooling a substrate
  • Substrate processing system, substrate chamber for a vacuum processing system, and method of cooling a substrate
  • Substrate processing system, substrate chamber for a vacuum processing system, and method of cooling a substrate

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Embodiment Construction

[0020] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals refer to the same components. Only differences with respect to individual embodiments are described. Each example is provided by way of explanation of the disclosure, not intended as a limitation of the disclosure. Additionally, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield still further embodiments. It is intended that this description cover such modifications and variations.

[0021] Exemplary reference figure 1 , depicts a substrate processing system 100 according to the present disclosure. According to an embodiment, which may be combined with other embodiments described herein, the substrate processing system 100 includes one or more substrate chamber...

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PUM

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Abstract

A substrate processing system (100) is described. The substrate processing system (100) includes one or more substrate chambers comprising a substrate transportation system (140). Further, the substrate processing system (100) includes one or more substrate cooling devices (150) arranged between a first track (141) and a second track (142) of the substrate transportation system (140). Additionally, a substrate chamber for a vacuum processing system, and a method for cooling a processes substrate is described.

Description

technical field [0001] Embodiments of the present disclosure relate to substrate processing systems, particularly vacuum processing systems for processing one or more substrates in a substantially vertical orientation, eg, for display production. Additional embodiments of the present disclosure relate to substrate chambers for vacuum processing systems. More particularly, embodiments of the present disclosure relate to vacuum processing systems and substrate chambers having substrate cooling devices. Yet another embodiment of the present disclosure relates to a method of cooling a substrate. Background technique [0002] Techniques for layer deposition on substrates include, for example, sputter deposition, thermal evaporation and chemical vapor deposition. Sputter deposition processes can be used to deposit layers of material, such as layers of conductive or insulating materials, on a substrate. Coating materials can be used in several applications and in several technic...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/677H01L21/324H01L21/56
CPCH01L21/67712H01L21/67109H01L21/67709H01L21/67173H01L21/67201H01L21/67276H01L21/67739H01L21/67098H01L21/67196H01L21/324H01L21/56
Inventor 哈利埃卢拉·谢里夫布里希·拉贾
Owner APPLIED MATERIALS INC