Processing system and method for material parts

Abstract

The invention discloses a processing system for material parts, and the system comprises a wax pasting mechanism, a transferring mechanism and a separating mechanism which are used for the materials, and the separating mechanism comprises a bearing unit, a shovel piece unit, a driving unit and a guiding unit. The bearing unit can rotate from a horizontal plane to an inclined plane under the action of the driving unit and then is arranged corresponding to the shovel sheet unit; a material part which is bonded through a wax body is borne on the bearing unit; the shovel piece unit can push the material piece to move relative to the supporting platform in a staggered mode so that the material piece can be separated from the supporting platform. The guiding unit comprises a guiding groove, the guiding groove is filled with flowing drainage liquid, and the drainage liquid can bear and drain the material piece to move from the inlet end to the outlet end. The wafer guiding and collecting device at least has the following advantages that the wafer does not make contact with an external mechanism in the guiding and collecting process while the shoveling difficulty is effectively reduced, and the phenomenon that the surface of the wafer is damaged is avoided.

Description

technical field [0001] The invention relates to the technical field of automation equipment, in particular to a processing system and method for materials. Background technique [0002] The statements in this section only provide background information related to the present disclosure and may not constitute prior art. [0003] Wafer is the carrier used in the production of integrated circuits, mostly referring to single crystal silicon wafers. Single crystal silicon wafers are drawn and refined from ordinary silica sand, and are made into single crystal silicon rods through a series of measures of dissolution, purification and distillation. After the single crystal silicon rods are polished and sliced, they become wafers. In the current production process, the surface of the wafer needs to be processed, and the wax dripping process is relatively common, so that the wafer will be bonded to the support after the liquid wax solidifies. Since the thickness of the wafer is rel...

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Problems solved by technology

[0004] In addition, due to the high precision requirements on the surface of the wafer, it is bound to require that the wear of the surface of the wafer in the above process and the subsequent collection process should be as small as possible. Transfer, which results in a long process cycle, and the inevitable contact action and adsorption force will more or less cause damage to the surface of the wafer

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