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Double silicon wheat encapsulation structure and preparation method of double silicon wheat encapsulation structure

A packaging structure, silicon microphone technology, applied in sensors, electrostatic transducer microphones, electrical components, etc., can solve the problem of reducing the sensitivity and signal-to-noise ratio of silicon microphones, the failure of the welding structure between the cover and the substrate, and the instability of the metal cover connection. and other problems to achieve the effect of avoiding welding failure, not easy welding failure, and stable structure

Active Publication Date: 2022-04-29
FOREHOPE ELECTRONICS NINGBO CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing silicon wheat structure has a low integration level, only a single silicon wheat structure, and the traditional stacked packaging technology is adopted, which makes the package size larger, which is not conducive to the miniaturization of products
In addition, in the conventional structure, the connection of the metal cover used to form the sound cavity is very unstable, and the welding structure between the cover and the base plate is likely to fail due to the warping of the base plate during cutting
And the conventional silicon microphone packaging structure usually adopts a monophonic cavity structure, and the bottom air space of the silicon microphone structure is small, which reduces the sensitivity and signal-to-noise ratio of the silicon microphone

Method used

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  • Double silicon wheat encapsulation structure and preparation method of double silicon wheat encapsulation structure
  • Double silicon wheat encapsulation structure and preparation method of double silicon wheat encapsulation structure
  • Double silicon wheat encapsulation structure and preparation method of double silicon wheat encapsulation structure

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no. 1 example

[0047] see figure 1 , this embodiment provides a dual-silicon wheat packaging structure 100, which can realize double-silicon wheat packaging, improve the integration degree of the silicon wheat structure, and reduce the package size at the same time, which is conducive to the miniaturization of products, and the structure is stable, and welding failure is not easy to occur phenomenon, and improve the sensitivity and signal-to-noise ratio of the product.

[0048] A double silicon wheat packaging structure 100 provided in this embodiment includes a first circuit board 110, a first silicon wheat chip 130, a first cover plate 150, a second silicon wheat chip 160, a second cover plate 170 and a second circuit board 190, the first circuit board 110 is provided with a first back sound hole 111 and a second back sound hole 113, the first back sound hole 111 and the second back sound hole 113 are arranged at intervals, and the first silicon wheat chip 130 is mounted on One side of th...

no. 2 example

[0063] see figure 2 , this embodiment provides a dual-silicon wheat structure, its basic structure and principle and the technical effect produced are the same as those of the first embodiment. corresponding content. The difference from the first embodiment lies in the setting position of the first sound inlet 115 .

[0064] In this embodiment, the double silicon wheat packaging structure 100 includes a first circuit board 110, a first silicon wheat chip 130, a first cover plate 150, a second silicon wheat chip 160, a second cover plate 170 and a second circuit board 190 , the first circuit board 110 is provided with a first back sound hole 111 and a second back sound hole 113, the first back sound hole 111 and the second back sound hole 113 are arranged at intervals, and the first silicon wheat chip 130 is mounted on the first One side of the circuit board 110, and the first silicon microphone chip 130 is arranged corresponding to the first back sound hole 111, and the fir...

no. 3 example

[0069] see image 3 , this embodiment provides a dual-silicon wheat structure, its basic structure and principle and the technical effect produced are the same as those of the first embodiment. corresponding content. The difference from the first embodiment lies in the setting position of the first sound inlet 115 .

[0070] The double silicon wheat package structure 100 comprises a first circuit board 110, a first silicon wheat chip 130, a first cover plate 150, a second silicon wheat chip 160, a second cover plate 170 and a second circuit board 190, the first circuit board 110 The first back sound hole 111 and the second back sound hole 113 are arranged on the top, the first back sound hole 111 and the second back sound hole 113 are arranged at intervals, and the first silicon wheat chip 130 is mounted on one side of the first circuit board 110 , and the first silicon wheat chip 130 is set correspondingly to the first back sound hole 111, the first cover plate 150 is mount...

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Abstract

Embodiments of the present invention provide a double-silicon microphone packaging structure and a preparation method of the double-silicon microphone packaging structure, which relate to the field of microphone packaging technology. The double-silicon microphone packaging structure includes a first circuit board, a first silicon microphone chip, a first The cover plate, the second silicon wheat chip, the second cover plate and the second circuit board are arranged on the second circuit board by pasting the first silicon wheat chip and the second silicon wheat chip on both sides of the first circuit board respectively. In the relief groove, the first cover plate is accommodated in the relief groove. Compared with the prior art, the double-silicon wheat packaging structure provided by the present invention can realize the double-silicon wheat packaging structure, improve the integration degree of the silicon wheat structure, and reduce the packaging size at the same time, which is conducive to the miniaturization of products, and the structure is stable and not easy to Soldering failure occurs, and the sensitivity and signal-to-noise ratio of the product are improved.

Description

technical field [0001] The invention relates to the technical field of microphone packaging, in particular to a double-silicon microphone packaging structure and a preparation method for the double-silicon microphone packaging structure. Background technique [0002] With the rapid development of the semiconductor industry, microphones have been widely used in various electronic products in the consumer field, among which silicon microphones have been widely used in mobile terminals due to their small size and strong stability. A silicon microphone includes a MEMS (Micro Electro Mechanical System, Micro Electro Mechanical System) chip, and the MEMS chip includes a silicon diaphragm and a silicon back plate. Among them, the working principle of the MEMS chip is to use the pressure gradient generated by the sound change to make the silicon diaphragm deformed by the sound pressure interference, and then change the capacitance value between the silicon diaphragm and the silicon ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R19/04H04R19/00H04R31/00
CPCH04R19/04H04R19/005H04R31/00
Inventor 张吉钦何正鸿
Owner FOREHOPE ELECTRONICS NINGBO CO LTD
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