Tail gas emission structure and reduction furnace

Abstract

The invention discloses a tail gas emission structure and a reduction furnace. The tail gas emission structure comprises a plurality of tail gas branch pipes, the first end of each tail gas branch pipe communicates with an annular pipe, and the first ends of the multiple tail gas branch pipes are arranged in the circumferential direction of the annular pipe at intervals. The annular pipe communicates with a balance box. The first end of a tail gas mother pipe communicates with the balance box. The tail gas branch pipes communicate with exhaust holes in the bottom of a reduction furnace, gas in the reduction furnace enters the tail gas branch pipes through the exhaust holes, tail gas in the tail gas branch pipes enters the annular pipe, tail gas in different tail gas branch pipes can be balanced in the annular pipe, and the tail gas in the annular pipe enters the balance box to be balanced, so that the pressure of the gas is more uniform, and then gas in the balance box is exhausted through the tail gas mother pipe. The gas flow in each tail gas branch pipe is balanced through the annular pipe and the balance box, so that the silicon formation condition and the silicon slag cleaning frequency in the tail gas branch pipes are reduced, the tail gas emission is kept uniform and stable, and the pressure, the flow field and the temperature field in the reduction furnace are more stable.

Description

technical field [0001] The application belongs to the technical field of polysilicon, and in particular relates to a tail gas discharge structure and a reduction furnace. Background technique [0002] Polysilicon is the main raw material for manufacturing integrated circuits and solar cells. The production of polysilicon mainly uses the improved Siemens method. Raw materials such as chlorosilane and hydrogen are sent into the reduction furnace to produce polysilicon by chemical vapor deposition (CVD) reaction on the silicon rods. During the production process, in order to ensure high production efficiency in the reduction furnace, To increase its deposition rate on the surface of the silicon rod, the raw material gas is continuously injected through the nozzle, and at the same time, the low-concentration chlorosilane after the reaction and the by-products during the reaction are continuously discharged through the tail gas port. When the tail gas flows through the tail gas ...

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Problems solved by technology

[0003] The purpose of the embodiments of the present application is to provide a tail gas discharge structure and a reduction furnace to solve the uneven pressure and flow rate of the gas in the tail gas pipe of the reduction furnace, resulting in instability of the pressure, flow field, and temperature field in the reduction furnace, which affects the formation of polysilicon quality problem

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