Phase change memory and preparation method thereof
A phase-change memory and contact hole technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of low-quality film layers of phase-change memory, improve layout flexibility, improve film layer quality, effect of device size
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[0079] For the phase change memory as mentioned above, the following combination Figure 4a The preparation method thereof will be described. Such as Figure 4a As shown, the preparation method of the phase change memory may specifically include: respectively forming an auxiliary bit line layer and an auxiliary word line layer in two planes parallel to each other, for example, the auxiliary bit line layer may be formed in the first plane, and the second forming an auxiliary word line layer in a second plane parallel to the plane; and etching the auxiliary word line layer and the auxiliary bit line layer to form a first contact hole; covering the sidewall of the first contact hole with isolation layer, and fill the first contact hole with a conductive material layer to form a first contact plug.
[0080] Based on the above preparation method, the first contact plug that is electrically insulated from the auxiliary bit line layer and the auxiliary word line layer can be formed...
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