High-precision measuring device and method for two-dimensional thermal expansion coefficient of material surface

A technology of thermal expansion coefficient and measuring device, which is applied in the direction of material thermal expansion coefficient, measuring device, heat measurement, etc., can solve the problems of insufficient measurement accuracy, low accuracy of thermal expansion coefficient of anisotropic materials, and limited number of measuring points

Pending Publication Date: 2021-08-31
SHANGHAI SATELLITE ENG INST
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above existing technologies, the inventor believes that the above technologies have insufficient measurement accuracy, limited number of measuring points, and can not realize t

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-precision measuring device and method for two-dimensional thermal expansion coefficient of material surface
  • High-precision measuring device and method for two-dimensional thermal expansion coefficient of material surface
  • High-precision measuring device and method for two-dimensional thermal expansion coefficient of material surface

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The present invention will be described in detail below in conjunction with specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0038] The embodiment of the invention discloses a measuring device for the two-dimensional thermal expansion coefficient in the material plane, such as figure 1 and figure 2 As shown, it includes a heating mechanism 5 for heating and deforming the test piece 6 (the heating mechanism 5 is an infrared lamp array), a laser deformation measurement system for real-time detection of the thermal deformation of the test piece 6, and a thermocouple for real-time monitoring of the temperature change of the test...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a high-precision measuring device and method for a two-dimensional thermal expansion coefficient of a material surface. The high-precision measuring device comprises a heating mechanism and a laser deformation measuring system, wherein the laser deformation measuring system comprises a laser, an optical splitter and a camera; the optical splitter splits laser emitted by the laser device to obtain multiple paths of split laser, and the multiple paths of split laser enter the camera through diffuse reflection of a to-be-tested piece; or the optical splitter splits the laser emitted by the laser device to obtain multiple paths of split laser, one part of the split laser directly enters the camera, and the other part of the split laser enters the camera through diffuse reflection of the test piece to be tested; the split laser entering the camera generates an interference image on the target surface of the camera. The device is advantaged in that measurement precision of the two-dimensional thermal expansion coefficient of the material surface is high, thermal deformation of all positions in the variable laser deformation measurement view field range can be measured, limitation of the number of measurement points is avoided, and accurate measurement performance and applicability of the thermal expansion coefficient of low-expansion-rate and anisotropic materials such as composite materials can be improved.

Description

technical field [0001] The invention relates to the technical field of measuring the coefficient of thermal expansion of materials, in particular to a high-precision measuring device and method for the two-dimensional thermal expansion coefficient of a material surface. Background technique [0002] Thermal expansion characteristics are one of the basic physical properties of materials. For structures subjected to alternating temperature loads, especially in the fields of aviation and aerospace, accurate thermal expansion coefficients are crucial to structural design. [0003] Common thermal expansion coefficient testing methods are mainly aimed at one-dimensional materials. The Chinese invention patent with publication number CN101140249A discloses a two-beam laser interferometry method for material thermal expansion coefficient, which involves two-beam laser interferometry for material thermal expansion coefficient. Place the sample to be tested in the high vacuum heating ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G01N25/16G01B11/16G01K7/02
CPCG01N25/16G01B11/16G01K7/02
Inventor 彭海阔陈夜张如变任友良王志国
Owner SHANGHAI SATELLITE ENG INST
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products