A kind of preparation method of low-temperature curing conductive copper paste

Abstract

A preparation method for low-temperature curing conductive copper paste, which belongs to the field of flexible electronics. The raw material composition of the conductive copper paste is as follows in terms of mass percentage: copper salt 20%~53%, nano copper powder 0.25%~5%, binder 0.1% ~3%, solvent 10%~30%, reducing agent 35%~55%; first add binder to the solvent to form a mixed solution, then add copper salt and nano-copper powder to the mixed solution, and finally add reducing agent to form Mix the slurry, control the viscosity of the mixed slurry to 10Pa·s~60Pa·s; add the mixed slurry to the planetary mixer and stir for 20-60 minutes for a dispersion; add the mixed slurry after the first dispersion to the three-roll mill After secondary dispersion, the obtained conductive copper paste can be cured at a low temperature below 180°C, which is suitable for circuit printing in flexible devices or the preparation of electronic components, and all raw materials are non-toxic and harmless, meeting the requirements of green production.

Description

technical field [0001] The invention belongs to the field of flexible electronics, and in particular relates to a preparation method of low-temperature curing conductive copper paste. Background technique [0002] In recent years, with the continuous development of electronic products in the direction of lightness, smallness, thinness and flexibility, flexible circuits that can meet the requirements of lightness, smallness, thinness and flexibility at the same time have been favored by scientific researchers, especially one of the core materials of flexible circuits ——Flexible electronic paste has also been developed by leaps and bounds. Compared with low-temperature curing conductive silver paste, low-temperature curing conductive copper paste has attracted more and more attention from domestic and foreign enterprises for its advantages of low cost and high conductivity. [0003] At present, there are still many problems in the low-temperature curing conductive copper past...

AI Technical Summary

Problems solved by technology

Invention patent "low-temperature sintered copper paste, preparation method and application" (CN 112940564 A), the phenyl glycidyl ether and cyclohexanone used have certain toxicity to the environment or human body; "a low-temperature conductive copper paste and its "Preparation method" (CN 109979686 A) uses silver-coated copper powder, the cost is high, and the particle size of the powder used is 5-15 μm, the curing temperature cannot reach below 200 °C, and the curing temperature is high

Images