Liquid-cooled radiator
A radiator and liquid cooling technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problem that the water cooling system is not enough to load the heat dissipation requirements of IC chips
Inactive Publication Date: 2021-09-10
INVENTEC PUDONG TECH CORPOARTION +1
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- Claims
- Application Information
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Problems solved by technology
[0003] However, with the development and progress of science and technology, the heat generated by the operation of IC chips has increased. The heat dissipation capacity of the current water-cooled cooling system is no longer sufficient to meet the heat dissipation requirements of IC chips.
Method used
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Embodiment Construction
[0012] see Figure 1 to Figure 2 . figure 1 A three-dimensional schematic diagram of a liquid-cooled heat sink provided by an embodiment of the present invention. figure 2 for figure 1 An exploded schematic of the liquid-cooled radiator shown.
[0013] The liquid-cooled radiator 10 of this embodiment is in thermal contact with a heat source (not shown), for example. The heat source is, for example, a CPU or an image processor. The liquid-cooled heat sink 10 includes a substrate 100 , a cover 200 and a barrier structure 300 .
[0014] The substrate 100 is made of thermally conductive material such as metal, and includes a plate body 110 , a set of first heat dissipation fins 120 and a set of second heat dissipation fins 130 . The plate body 110 is used for thermal contact with a heat source. The set of first heat dissipation fins 120 and the set of second heat dissipation fins 130 protrude from the same side of the board body 110 and maintain a gap G therebetween. The c...
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The invention provides a liquid-cooled radiator. The liquid-cooled radiator comprises a substrate, a cover body and a barrier structure. The substrate comprises a plate body, a group of first radiating fins and a group of second radiating fins. The group of first radiating fins and the group of second radiating fins protrude out of the same side of the plate body. The cover body is provided with a water inlet and a water outlet. The cover body is stacked on the plate body, and the cover body and the plate body jointly surround the set of first heat dissipation fins and the set of second heat dissipation fins and jointly form a heat exchange cavity. The blocking structure is located between the set of first heat dissipation fins and the set of second heat dissipation fins and divides the heat exchange cavity into a water inlet cavity and a water outlet cavity. The water inlet chamber is communicated with the water inlet. The water outlet chamber is communicated with the water outlet. The group of first radiating fins are positioned in the water inlet chamber. The group of second radiating fins are positioned in the water outlet chamber. The overall structural strength of the liquid-cooled radiator can be enhanced, and meanwhile the heat exchange efficiency of the cooling fluid and the liquid-cooled radiator is improved.
Description
technical field [0001] The invention relates to a radiator, in particular to a liquid-cooled radiator. Background technique [0002] In a computer system, the central processing unit of the motherboard, the north bridge chip, the south bridge chip and the graphics chip are all integrated circuit (IC) chips, and the IC chip is the largest heat source when the computer processes calculations. In order to quickly remove the heat energy generated by the IC chip of the main board during high-speed operation, the water-cooled heat dissipation system uses a cold plate to directly contact the back of the IC chip, and uses the cooling liquid flowing through the cold plate to take away the waste heat to make the waste heat Conducted to the water cooling row through the circulating water circuit. [0003] However, with the development and progress of technology, the heat generated by the operation of IC chips increases accordingly. The heat dissipation capacity of the current water co...
Claims
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IPC IPC(8): G06F1/20
CPCG06F1/20F28F3/12F28F3/025F28D2021/0029F28D1/035F28F2250/102H05K7/20218H05K7/2039
Inventor 季懿栋项品义邬将军陈雪锋
Owner INVENTEC PUDONG TECH CORPOARTION