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Heat storage/heat dissipation structure, heat storage/heat dissipation device and electronic device

A technology of heat dissipation structure and heat dissipation device, which is applied in the direction of modification through conduction heat transfer, cooling/ventilation/heating modification, modification with liquid cooling, etc., which can solve the problem that the heat storage effect cannot be fully utilized, the heat conduction effect is poor, and cannot be fully utilized. Issues such as all areas of phase change materials

Pending Publication Date: 2021-09-14
NITRONIX NANOTECHNOLOGY CORP
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

In addition, the heat conduction effect of the thermal phase change material itself is poor, and the heat storage effect may only be effectively exerted in the area close to the heat source, and the entire area of ​​the phase change material cannot be fully utilized, so the heat storage effect cannot be fully exerted

Method used

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  • Heat storage/heat dissipation structure, heat storage/heat dissipation device and electronic device
  • Heat storage/heat dissipation structure, heat storage/heat dissipation device and electronic device
  • Heat storage/heat dissipation structure, heat storage/heat dissipation device and electronic device

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Embodiment Construction

[0024] The heat storage / radiation structure, heat storage / radiation device and electronic device according to the preferred embodiments of the present invention will be described below with reference to the relevant drawings, wherein the same components will be described with the same reference symbols.

[0025] The heat storage / radiation structure or heat storage / radiation device of the present invention can be applied to, for example but not limited to, notebook computers, desktop computers, mobile phones, tablet computers, monitors and related computer equipment or display devices in servers, or other electronic equipment heat dissipation. The aforementioned notebook computer, desktop computer, mobile phone, tablet computer, and monitor have a display panel, which may be, for example but not limited to, a liquid crystal display panel, an organic light emitting diode display panel, or a quantum dot display panel.

[0026] The heat storage / radiation structure or heat storage / ...

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Abstract

The invention relates to a heat storage / heat dissipation structure, a heat storage / heat dissipation device and an electronic device. The invention discloses a heat storage / heat dissipation structure which comprises at least one thermal phase change element and a heat conduction coating layer. The thermal phase change element extends along a first direction and / or a second direction, and the first direction and the second direction are perpendicular to each other. The heat conduction coating layer is arranged on the periphery of the thermal phase change element and covers the whole outer surface of the thermal phase change element. The invention further discloses a heat storage / dissipation device and an electronic device.

Description

technical field [0001] The present invention relates to a heat storage / radiation structure, in particular to a heat storage / radiation structure containing a thermal phase change material, a heat storage / radiation device, and a device using the heat storage / radiation structure or the heat storage / radiation device electronic device. Background technique [0002] Thermal phase change material (phase change material, PCM) can absorb or release a large amount of heat during the phase change process, which can realize energy storage, utilization and temperature control. Therefore, it is widely used in energy-saving energy storage, air conditioning, building materials, aerospace and thermal management and other fields. Thermal phase change materials can be mainly divided into solid-solid phase change and solid-liquid phase change according to the phase change form. Among them, the solid-liquid phase change material is the most widely used phase change material at present, but its...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/2029H05K7/2039
Inventor 吴丰宇黄汉璋何铭祥
Owner NITRONIX NANOTECHNOLOGY CORP
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