An epoxy-based two-dimensional sheet metal nano-filler with ultra-high isotropic thermal conductivity material and preparation method thereof

Abstract

The invention provides an epoxy-based two-dimensional sheet-shaped metal nanofiller with ultra-high isotropic thermal conductivity and a preparation method thereof. The components of the material mainly include epoxy resin, two-dimensional sheet-shaped metal nanofillers, two-dimensional sheet A carbon-based heat-conducting filler and a diluent are prepared by uniformly mixing the above components, removing the diluent, and then preparing heat-conducting materials or parts through a hot-press molding process. The present invention forms a three-dimensional heat conduction network by lapping two two-dimensional sheet-shaped heat-conducting fillers in the epoxy resin matrix, thereby realizing efficient overlapping and high-efficiency synergistic effects of two-dimensional sheet-shaped metal nanofillers, and greatly improving the obtained heat-conducting materials or parts. Excellent thermal conductivity, and has isotropic thermal conductivity characteristics.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting materials, and in particular relates to an epoxy-based two-dimensional sheet-shaped metal nano-filler with ultra-high isotropic heat-conducting material and a preparation method thereof. Background technique [0002] With the vigorous development of power density in the fields of microelectronics, optoelectronics, and energy harvesting, the problem of thermal management is becoming more and more prominent. Insufficient heat dissipation will cause heat to accumulate in electronic devices. Overheating of electronic devices will shorten the service life of the device, cause damage to the device and even cause a fire. Therefore, in such fields, the thermal management problem needs to be optimized and solved urgently. Therefore, the key to solving thermal management problems is to develop high-efficiency thermal conductivity materials and realize the commercial application of this type of ther...

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Problems solved by technology

[0007] It can be seen from the above that most of the current polymer composite thermal conductive materials filled with metal composite fillers utilize the synergistic effect of different thermal conductive fillers to a certain extent, but their thermal conductivity is still low, usually difficult to exceed 5W / m·K , and the heat conduction is usually anisotropic, and only one direction has good heat conduction performance, while the heat conduction performance in other directions is very poor, and it is difficult to meet higher heat conduction standards and requirements, thus limiting the use of materials Product shape specification and scope of application

In addition, in order to achieve better thermal conductivity, high-cost raw materials are usually selected, and the preparation method is relatively complicated, which is not suitable for the preparation of high-efficiency thermal interface materials that can be used commercially.

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