Method and device for aligning platform by using camera and direct imaging photoetching equipment

Abstract

The invention provides a method for aligning a platform by using a camera. The method comprises the steps: S101, moving a platform until an identification mark on the platform is aligned with the center of an image of a camera, and obtaining a benchmark reference position of the platform; S102, moving the platform with different movement amounts, and acquiring images of the identification mark at different positions in the view field of the camera through the camera; S103, based on the images at different positions, obtaining the pixel offset between the identification mark and the center of the image; S104, calculating first coordinates of the platform at different positions based on the benchmark reference position and the movement amount of the platform; and S105, at different positions, on the basis of the pixel offset, the first coordinate and the benchmark reference position, calculating compensation amounts of different positions in the view of the camera, and establishing a calibration alignment compensation table of the camera. According to the invention, errors of target positions captured at different positions in the view of the same group of cameras during alignment can be reduced, the influence of camera lens distortion and light sources on imaging quality is reduced, and the problem of offset of vacancy of the PCB after exposure is improved.

Description

technical field [0001] The present disclosure relates to the technical field of direct imaging, and in particular to a method for aligning a platform by using a camera, an alignment device, and a direct imaging lithography equipment. Background technique [0002] Photolithography technology refers to the technology of transferring the pattern on the mask plate to the substrate by means of photoresist under the action of light. Laser direct imaging lithography equipment abandons the traditional exposure machine using the film film image transfer method, and can realize the direct control of the laser for image transfer without film, which promotes the further development of PCB board and semiconductor manufacturing technology, which is of great significance. [0003] In the process of parts manufacturing and assembly of laser direct imaging lithography equipment, due to the error of the motion platform, the distortion of the camera lens and the influence of the light source o...

AI Technical Summary

Problems solved by technology

In the prior art, the alignment compensation value adopts the method of determining the compensation value of the left and right cameras according to the exposure result after the actual exposure. This method is effective when the Mark point is at the same position of the camera field of view. In practice, the positioning holes

Images