Semiconductor structure and preparation method thereof

Abstract

The invention relates to a semiconductor structure and a preparation method thereof. The preparation method of the semiconductor structure comprises the steps of providing a substrate; forming a plurality of contact holes arranged at intervals in the substrate; forming a contact material layer in the contact hole; forming a bit line material layer on the contact material layer and the substrate; and removing part of the bit line material layer and part of the contact material layer to form a bit line structure, wherein the bit line structure comprises a bit line layer formed by the remaining bit line material layer and a contact layer formed by the remaining contact material layer, the contact layer is located in the contact hole, and the bit line layer crosses the contact hole and the substrate outside the contact hole. According to the invention, the height of the bit line structure can be effectively reduced, so that the bit line structure is effectively prevented from inclining or collapsing in the subsequent manufacturing process.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor structure and a preparation method thereof. Background technique [0002] In the manufacturing process of semiconductor memory devices, bit lines are usually formed by dry etching. After the bit lines are formed by dry etching, a series of organic substances caused by dry etching can be removed by wet cleaning. [0003] However, during wet cleaning, there will be tension between the bit lines due to the flow of the solution. Tension can easily cause the bit line to tilt and collapse. Contents of the invention [0004] Based on this, it is necessary to provide a semiconductor structure and a preparation method thereof for the problem that the bit line is easily tilted and collapsed due to tension during wet cleaning. [0005] A method for preparing a semiconductor structure, comprising: [0006] provide the basis; [0007] forming a plurality of conta...

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Problems solved by technology

[0004] Based on this, it is necessary to provide a semiconductor structure and its preparation method for the problem that the tension can easily cause the bit line to tilt and collapse during wet cleaning.

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