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Mini LED repair platform

A platform and platen technology, applied in the field of miniLED rework platform, can solve the problems of missing or falling off, waste of raw materials, economic losses, etc., to prevent waste, avoid economic losses, and save raw materials.

Pending Publication Date: 2021-10-01
先进光电器材(深圳)有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Due to the large increase in the number of LED chips that need to be packaged on the same display area for small-pitch mini LED products, and LED chips of three colors R, G, and B need to be fixed in each LED unit of the display screen, resulting in mini LED The probability of chip damage, offset, missing or falling off during the product packaging process is also multiplied. However, the mini LED products currently on the market are all molded in one shot, and there is no effective compensation for defective products in the production process. Therefore, Defective products can only be scrapped, resulting in waste of raw materials and economic losses

Method used

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Embodiment 1

[0038] Please refer to Figure 1 to Figure 11, Embodiment 1 of the present invention is: a mini LED rework platform, which is used to repair defective products that occur in the production process of LED products and products that have failed during use, and repair damaged or offset chips on the reworked products Peel off and install a new chip, or re-attach the chip on the position where the chip has fallen off or is missing on the reworked product, so that the reworked LED product can meet the use requirements.

[0039] like figure 1 As shown, the mini LED rework platform includes a platen 1, and the platen 1 is provided with a working box 2, a material loading component 3, a rubber plate component 4, a first XY moving component 5 and a second XY moving component 6. The first XY moving assembly 5 and the second XY moving assembly 6 are respectively arranged above the work box 2, wherein the work box 2 is used to fix the position of the product to be repaired, and the first ...

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Abstract

The invention discloses a mini LED repair platform, which comprises a table plate, wherein a working box, a material carrying assembly, a glue disc assembly, a first XY moving assembly and a second XY moving assembly are arranged on the table plate, a laser assembly, a suction assembly and a glue dispensing assembly are arranged on the first XY moving assembly, the laser assembly comprises a laser transmitter, the suction assembly comprises a first suction nozzle used for sucking waste wafers and a second suction nozzle used for sucking molten solder paste, the glue dispensing assembly comprises a glue dispensing needle matched with the glue disc assembly, the second XY moving assembly is provided with a mounting assembly, and the mounting assembly comprises a third suction nozzle used for picking up a new wafer from the material carrying assembly and mounting the new wafer to the repaired product in the working box. According to the mini LED repair platform, defective products occurring in the production process of LED products can be repaired, so that the repaired products meet the use requirements, waste caused by scrapping of the repaired products is prevented, raw materials are saved, and economic losses caused by production of products with poor quality are avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging equipment, in particular to a mini LED rework platform. Background technique [0002] With the development of LED chips and the advancement of packaging technology, mini LED displays with higher resolution and better picture display have appeared on the market. Due to the large increase in the number of LED chips that need to be packaged on the same display area for small-pitch mini LED products, and LED chips of three colors R, G, and B need to be fixed in each LED unit of the display screen, resulting in mini LED The probability of chip damage, offset, missing or falling off during the product packaging process is also multiplied. However, the mini LED products currently on the market are all molded in one shot, and there is no effective compensation for defective products in the production process. Therefore, Defective products can only be scrapped, resulting in waste of raw ma...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L21/67
CPCH01L33/0095H01L21/67144
Inventor 张跃春罗元明郑德全
Owner 先进光电器材(深圳)有限公司
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