A kind of semiconductor device and its manufacturing method

Abstract

The present invention relates to a semiconductor device and a manufacturing method thereof, by forming first and second grooves in the first, second, third and fourth chips respectively , third, and fourth blind holes, and respectively form first, second, third, and fourth protrusions on the respective back surfaces of the fifth, sixth, seventh, and eighth chips, and The side surfaces of the second, third, and fourth protrusions respectively form through holes, and then in the subsequent bonding process, in the first, second, third, and fourth grooves and the first, second, and third 1. Adhesive material is set in the fourth blind hole, and the fifth, sixth, seventh, and eighth chips are correspondingly set in the first, second, third, and fourth grooves, so that the first, the first Two, third, and fourth protrusions are respectively embedded in the corresponding first, second, third, and fourth blind holes, and a part of the bonding material in each blind hole is embedded in each through hole of each protrusion .

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a semiconductor device and a preparation method thereof. Background technique [0002] In the existing semiconductor stack packaging technology, usually an adhesive material is directly provided between the first semiconductor chip and the second semiconductor chip to complete the bonding of the first semiconductor chip and the second semiconductor chip, and then use the resin material to package the above-mentioned bonding the completed first semiconductor chip and the second semiconductor chip. However, in the actual packaging process, since the bonding stability of the first semiconductor chip and the second semiconductor chip is not high, it is easy to cause peeling dislocation between the first semiconductor chip and the second semiconductor chip in the process of encapsulating with resin, This further affects the stability of the semiconductor stack package structure...

AI Technical Summary

Problems solved by technology

However, in the actual packaging process, since the bonding stability of the first semiconductor chip and the second semiconductor chip is not high, it is easy to cause peeling dislocation between the first semiconductor chip and the second semiconductor chip in the process of encapsulating with resin, In turn, it affects the stability of the semiconductor stack package structure, which in turn leads to an increase in manufacturing costs

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