The present invention relates to a
semiconductor device and a manufacturing method thereof, by forming first and second grooves in the first, second, third and fourth chips respectively , third, and fourth blind holes, and respectively form first, second, third, and fourth protrusions on the respective back surfaces of the fifth, sixth, seventh, and eighth chips, and The side surfaces of the second, third, and fourth protrusions respectively form through holes, and then in the subsequent
bonding process, in the first, second, third, and fourth grooves and the first, second, and third 1.
Adhesive material is set in the fourth
blind hole, and the fifth, sixth, seventh, and eighth chips are correspondingly set in the first, second, third, and fourth grooves, so that the first, the first Two, third, and fourth protrusions are respectively embedded in the corresponding first, second, third, and fourth blind holes, and a part of the bonding material in each
blind hole is embedded in each through hole of each protrusion .