Porous groove white pad for polishing and grinding and production method

A white pad and hole groove technology, applied in the field of white pad, can solve the problems of reducing the polishing quality, failing to remove debris in time, and affecting the service life of the polishing pad, so as to improve the polishing quality, service life, and chip removal. Effect

Active Publication Date: 2021-10-19
ANHUI HECHEN NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the polishing pad in the above-mentioned patent cannot timely remove the debris generated by polishing and grinding, thereby reducing the polishing quality. During the polishing process, local high temperature is easily generated due to the high polishing speed, and the local high temperature reduces the polishing quality and affects the use of the polishing pad. life

Method used

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  • Porous groove white pad for polishing and grinding and production method
  • Porous groove white pad for polishing and grinding and production method
  • Porous groove white pad for polishing and grinding and production method

Examples

Experimental program
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Effect test

Embodiment 1

[0045] refer to figure 1 , a porous groove white pad for polishing and grinding, comprising a high elastic layer 1, a transition layer 2, a polishing surface layer 3 and an abrasive layer 4 arranged in sequence from bottom to top, the high elastic layer 1, the transition layer 2, and the polishing surface layer 3 The abrasive material layer 4 is sequentially compounded and connected together, and the high elastic layer 1, the transition layer 2 and the polishing surface layer 3 are overlapped with each other to be provided with a plurality of through holes 5 that are narrow at the top and wide at the bottom. The weight of each component of the raw materials used in the high elastic layer 1 The ratio of servings is as follows:

[0046] 20 parts of the first silica gel;

[0047] 20 parts of the first nitrile rubber;

[0048] 55 parts of the first thermoplastic resin;

[0049] 5 parts of the first auxiliary agent;

[0050] Among them, nitrile rubber is composed of butadiene a...

Embodiment 2

[0076] The difference between the present embodiment and the first embodiment is only that the proportion of the raw materials in the high elastic layer 1 is different. In the present embodiment, the ratio of the parts by weight of the raw materials used in the high elastic layer 1 is as follows:

[0077] 40 parts of the first silica gel;

[0078] 20 parts of the first nitrile rubber;

[0079] 35 parts of the first thermoplastic resin;

[0080] 5 parts of the first auxiliary agent;

[0081] Wherein, the component weight of the first silica gel is increased to 40 parts, and the weight part of the first thermoplastic resin is correspondingly reduced to 35 parts, and the elasticity index of the high elastic layer 1 is adjusted by changing the component weight parts to adapt to white The height of the pad is deformed.

Embodiment 3

[0083] The difference between the present embodiment and the first embodiment is only that the raw material composition ratio of the transition layer 2 is different. In the present embodiment, the ratio of the parts by weight of the raw materials used in the transition layer 2 is as follows:

[0084] 15 parts of the second silica gel;

[0085] 5 parts of the second nitrile rubber

[0086] 30 parts of the second water-based epoxy resin glue;

[0087] 48 parts of the second polyurethane;

[0088] 2 parts of the second auxiliary agent;

[0089] Wherein, the hardness and elasticity of the transition layer 2 are between the highly elastic layer 1 and the polishing surface layer 3, and when the white pad is bent and deformed toward the polishing surface layer 3, the polishing surface layer 3 with low deformation and the high elasticity layer with high deformation are linked together. Layer 1.

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Abstract

The invention discloses a porous groove white pad for polishing and grinding and a production method, and belongs to the technical field of white pads. The porous groove white pad comprises a high-elasticity layer, a transition layer, a polishing surface layer and an abrasive material layer which are sequentially arranged from bottom to top, the high-elasticity layer, the transition layer, the polishing surface layer and the abrasive material layer are sequentially connected together in a composite mode, and a plurality of through holes with narrow tops and wide bottoms are formed after the high-elasticity layer, the transition layer and the polishing surface layer are overlapped with one another. Trumpet-shaped through holes with the narrow tops and the wide bottoms are formed in the white pad, the through holes are used for dissipating heat, local high temperature caused by friction is reduced, the service life of the white pad is prolonged, and the polishing quality is improved. The white pad is tightly attached to an object to be polished, the polishing surface layer and the abrasive material layer bend and deform towards one side of the abrasive material layer, the ports, facing the outer side, of the through holes are expanded, and the chip removal amount of the through holes is increased.

Description

technical field [0001] The invention relates to the technical field of white pads, in particular to a white pad with porous grooves for polishing and grinding and a production method thereof. Background technique [0002] Polishing pads are also called polishing skins, polishing cloths, polishing sheets, important auxiliary materials that determine the surface quality in chemical mechanical polishing. Patent No. CN201911081582.X discloses a polishing white pad with microporous grooves and a production method thereof. The polishing white pad with microporous grooves includes a polishing pad, an adhesive layer and a support layer: the adhesive The layer is evenly coated on one circumferential surface of the support layer, the polishing pad is covered on the other circumferential surface of the adhesive layer and pressed tightly, and the polishing pad, adhesive layer and support layer are superimposed and fixed on the outer ring and inserted into the locking ring , the thermal...

Claims

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Application Information

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IPC IPC(8): B24D11/02B24D11/00C08L23/06C08L23/12C08L27/06C08L25/06C08L77/00C08L59/02C08L69/00C08L71/12C08L81/06C08L83/04C08L9/02C08L51/08C08L75/04C08K3/22C08K3/26C08L7/00C08L23/34C08K3/04
CPCB24D11/02B24D11/001C08L23/06C08L23/12C08L27/06C08L25/06C08L77/00C08L59/02C08L69/00C08L71/12C08L81/06C08L83/04C08L51/08C08L7/00C08K2201/011C08K2003/2241C08K2003/2296C08K2003/265C08K2003/2227C08K2003/222C08K2003/2206C08L9/02C08L75/04C08K3/22C08K3/26C08L23/34C08K3/04
Inventor 李加海谭鸿
Owner ANHUI HECHEN NEW MATERIAL CO LTD
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