Cleaning device for welded circuit board
A cleaning device and post-soldering technology, applied in the cleaning method of tools, cleaning/polishing of conductive patterns, removing smoke and dust, etc., can solve the problems of circuit board damage, affecting the health of workers, and the cleaning solvent cannot be volatilized and cleaned independently. , to achieve the effect of safe use
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[0056] Example 1:
[0057] Append figure 1 Attachment Figure 15 Looking:
[0058] The present invention provides a widaking device after welding of a circuit board, including a housing device 1;
[0059] The housing device 1, the housing device 1 is fixed to the volatile device 8 by a bolt;
[0060] Support structure 2, the support structure 2 slides on the housing device 1;
[0061] The flip device 3 is connected to the support structure 2 by a rotating shaft;
[0062] The adjustment device 4 is connected to the finishing device 3 by the rotation shaft;
[0063] The positioning device 5, the positioning device 5 slides to be connected to the adjustment device 4;
[0064] Dust removing structure 6, the dust removal structure 6 is connected to the housing device 1 by the rotating shaft;
[0065] The cleaning device 7 is fixed to the housing device 1.
[0066] Append Figure 4 As shown, the housing device 1 includes:
[0067] Installing the box body 101, the mounting the box body 101...
Example Embodiment
[0095] Example 2
[0096] On the basis of the first example, when the circuit board enters the device, the dust removal rack 601 drives the rotary dust pad roller 602 to clean the dust and divide the wire board, which can be cleaned with the wire board. Wiping the solder joint; due to the wire board, each electronic component is often welded on the same side of the circuit board through the pin, so that the dust pad welding surface is cleaned with the needle welding surface, and does not require electronic components. The surface of the circuit board is cleaned to prevent the dust removal pad roller 602 from cause loose and deprotecting the electronic components; and when the wiring board is cleaned and moved outward, the dust removal rack 601 on the dust removal structure 6 is following the support bracket 202. During the movement, the rotary dust pad roller 602 is driven to clean the solvent residue on the wiring board, and since there are more electronic components soldered on ...
Example Embodiment
[0101] Example three
[0102] On the basis of the second embodiment, in order to accurately control the spacing of the dust removal pad 6023 on the dust removal cotton roller 602, the spacing of the circuit board surface is ensured, so that the dust removal cotton bar 6023 can press the wire plate pin welding surface, improve the The cleaning effect of the surface; on the other hand, when the height of the electronic component on the circuit board is large, the distance between the dust removal cotton bar 6023 and the circuit board is increased, and the solvent remaining on the wire board is effectively cleaned while ensuring the removal cable 6023. It can prevent the electronic components above the excess extruded circuit board, resulting in loose and deprotecting the electronic component, thus further improvement of the second magnetic suction block 6025 in the apparatus.
[0103] The second magnetochor block 6025 is an electromagnet which controls the magnitude of the magnetic ...
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