Semiconductor structure and package structure
A semiconductor and wire technology, applied in the field of semiconductor packaging structure and packaging structure, can solve problems such as not completely satisfactory, signal loss, power loss, etc., and achieve the effect of reducing signal loss, good electrical performance, and reliable signal transmission
Pending Publication Date: 2021-10-22
MEDIATEK INC
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- Abstract
- Description
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- Application Information
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Problems solved by technology
[0003] While existing packaging structures are adequate for their intended purpose, they are not entirely satisfactory in all respects
For example, signal loss and / or power loss can occur between die in the package structure
Method used
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[0024] The following description is of the best contemplated mode of carrying out the invention. This description is made to illustrate the general principles of the invention and should not be considered in a limiting sense. The scope of the invention is determined by the appended claims.
[0025] Hereinafter, the inventive concept will be fully described with reference to the accompanying drawings, in which exemplary embodiments of the inventive concept are shown. Advantages and features of the inventive concept and methods of achieving them will become apparent from the following exemplary embodiments, which will be described in more detail with reference to the accompanying drawings. It should be noted, however, that the inventive concept is not limited to the following exemplary embodiments, and may be implemented in various forms. Therefore, the exemplary embodiments are provided only to disclose the inventive concept and to let those skilled in the art know the catego...
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The invention discloses a semiconductor structure. The semiconductor structure comprises a substrate layer; semiconductor dies on the substrate layer, each of the semiconductor dies including an active region and a seal ring region, the seal ring region including a seal ring surrounding the active region; and an inter-die connection layer electrically connecting two adjacent semiconductor dies, the inter-die connection layer extending over adjacent portions of the seal ring in the seal ring region of the two adjacent semiconductor dies. Because signal loss (and / or power loss) between the semiconductor dies of the embodiments can be significantly reduced, similarly, a package structure including a multi-die assembly with multiple semiconductor dies in embodiments, has better electrical performance than a package structure having multiple dies individually from a conventional chip.
Description
technical field [0001] The invention relates to the technical field of semiconductors, in particular to a semiconductor package structure and a package structure. Background technique [0002] Semiconductor packages not only provide protection for the semiconductor die from environmental pollutants, but also provide electrical communication between the semiconductor die packaged therein and another device, such as a printed circuit board (PCB). connect. For example, one or more semiconductor die may be encapsulated in an encapsulating material and electrically connected to a substrate of the semiconductor package. The semiconductor package can then be electrically connected to the printed circuit board using a bonding process. For example, a semiconductor package may have a bump structure on a bottom surface of a substrate, and the bump structure is mounted on and electrically coupled to a printed circuit board. Different package types of semiconductor packages have been ...
Claims
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IPC IPC(8): H01L25/18H01L23/31H01L23/488
CPCH01L23/3128H01L24/02H01L24/13H01L25/18H01L2224/02331H01L2224/02333H01L2224/02381H01L2224/13008H01L23/49822H01L23/49816H01L23/522H01L25/0655H01L23/585H01L23/564H01L2224/24137H01L2224/24991H01L2224/25175H01L2224/73259H01L24/24H01L24/25H01L23/02H01L23/544H01L23/5386
Inventor 傅传贤张正佶
Owner MEDIATEK INC