Elastic wave device package and manufacturing method thereof
A device packaging and elastic wave technology, applied in the direction of electrical components, impedance networks, etc., can solve problems such as difficulty in ensuring thickness, difficulty in thinning piezoelectric substrates, difficulty in meeting physical surface characteristics requirements, etc., to improve frequency temperature characteristics and manufacturing costs Reduced effect
Pending Publication Date: 2021-10-22
SANAN JAPAN TECH CORP
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Problems solved by technology
Therefore, it is difficult to reduce the thickness of the piezoelectric substrate
In addition, it is difficult to ensure the thickness of the glass layer formed by the SOG method, and it is also difficult to meet the characteristic requirements of the physical surface
Method used
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[0042]
[0043] according to figure 1 A first embodiment of the elastic wave device package of the present invention will be described. The elastic wave device package 1 includes a mounting substrate 2, a piezoelectric substrate 3, a resin layer 4, a binder 5, and a support substrate 6. The mounting substrate 2 is a master substrate for mounting an elastic wave device in a map not shown. The mounting substrate 2 can use a substrate of insulating materials such as ceramics, glass, and resin.
[0044] The mounting substrate 2 is facing upward in the drawing, and a pad electrode 8 for mounting an elastic wave device is formed. Further, the mounting substrate 2 is formed downward in the drawing, and a pad electrode 9 for mounting to the mother substrate is formed. The pad electrode 8 and the lower pad electrode 9 on the upper surface of the substrate 2 are attached to each other by a conductor 11 provided on the side or the inside of the mounting substrate 2. If the laminated substra...
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Abstract
The invention provides an elastic wave device package which can improve frequency-temperature characteristics, can reduce manufacturing cost, and can be thinned, and a manufacturing method thereof. The elastic wave device package includes a piezoelectric substrate having an excitation electrode of an elastic surface wave and a pad electrode, and a mounting substrate on which the piezoelectric substrate is mounted. The mounting substrate is provided with a resin layer which surrounds the periphery of the piezoelectric substrate and is in close contact with the periphery of the piezoelectric substrate. The surface of the piezoelectric substrate on the opposite side of the mounting substrate is formed on the same surface as the surface of the resin layer on the opposite side of the mounting substrate. A support substrate having a lower coefficient of thermal expansion than the piezoelectric substrate and a larger area than the piezoelectric substrate is bonded by an adhesive to the surfaces of the piezoelectric substrate and the resin layer which are formed on the same surface. In other forms, a mounting substrate having a lower coefficient of thermal expansion than the piezoelectric substrate may be used, and an insulating film may be bonded to the resin layer and the piezoelectric substrate instead of the support substrate.
Description
Technical field [0001] Excellent temperature characteristics of the present invention relates to a frequency, and thinning acoustic wave device package, and a manufacturing method can be achieved. Background technique [0002] Generally the surface acoustic wave device, for example, Patent Document 1 (Japanese Laid-Open Patent Publication No. 2006-128809) as described, and as Figure 7 Shown, having a package structure is referred to as CSP (Chip Scale Package) is. This elastic wave device is encapsulated, comprising 50, die 51 and the elastic wave device of a substrate for mounting the molding resin 52 is mounted on the mother board (not shown) of. Mounting substrate 50 includes a pad electrode 51 for mounting the bare chip 53. Die 51 comprising a bonded substrate formed by bonding the piezoelectric substrate 55 and the supporting substrate 56. Forming the reflector and the lead electrode pattern serving as a wiring and the like comb-shaped electrode exciting electrode 57, the pa...
Claims
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IPC IPC(8): H03H3/08H03H9/25H03H9/64
CPCH03H3/08H03H9/25H03H9/64
Inventor 中村博文熊谷浩一门川裕
Owner SANAN JAPAN TECH CORP