Circuit board manufacturing method and circuit layer processing device thereof

Abstract

The invention relates to a circuit board manufacturing method and a circuit layer processing device thereof. The manufacturing method comprises the following steps of selectively performing electro-deposition on a carrier to form a circuit layer with a preset pattern; arranging an insulating base material on the line layer side of the carrier, and the line layer and the insulating base material being fixedly connected and combined into a whole; and separating the circuit layer from the carrier, wherein the circuit layer and the insulating substrate form a circuit board. According to the invention, the difficulty of the circuit board manufacturing process can be reduced, the circuit board with a complex structure can be processed, the line shape and thickness in the circuit board can be controlled, and the processing precision and efficiency of the circuit board can be improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a circuit board manufacturing method and a circuit layer processing device thereof. Background technique [0002] The existing production process of printed circuit board (PCB) is complicated. First, it is necessary to cut the copper clad laminate and roughen the copper surface, then apply photosensitive oil or paste photosensitive dry film on the copper surface, and then go through exposure, development and etching. The preset copper layer pattern can be generated by processes such as film removal and film removal. This process needs to be repeated for each layer of copper pattern of a multilayer circuit board, and each layer generally needs to be customized with a negative film corresponding to the copper pattern (such as film, silver salt, etc.) photosensitive film), which makes the production cycle of the printed circuit board long and the prod...

AI Technical Summary

Problems solved by technology

If a circuit board is formed by selective spraying based on conductive ink (such as nano-silver conductive ink) onto an insulating substrate, the production speed is often slow, the conductivity needs to be improved, and the cost is high.

The circuit board is formed by laying metal powder on the insulating board according to the preset pattern and then heating or sintering, which often leads to limited precision and high production cost.

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