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Heat-conducting gasket film laminating machine and film laminating method

A heat-conducting gasket and laminating machine technology, which is applied in the directions of automatic packaging control, external support, transportation packaging, etc., can solve problems such as adverse effects on product quality, pollution of heat-conducting gaskets, and low efficiency of laminating, so as to avoid pollution and improve The effect of improving product quality and improving production efficiency

Pending Publication Date: 2021-11-02
页川智能科技山东有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there is no equipment for coating thermal pads. Usually, the thermal pads are removed from the film body manually, and then the bottom film and the mask are used to protect the thermal pads. The efficiency of the coating is low, and it is inevitable to Fingerprints are left on the surface of the gasket, thereby polluting the thermal pad and adversely affecting product quality

Method used

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  • Heat-conducting gasket film laminating machine and film laminating method
  • Heat-conducting gasket film laminating machine and film laminating method
  • Heat-conducting gasket film laminating machine and film laminating method

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Embodiment Construction

[0033] In order to clearly illustrate the technical features of the solution, the solution will be described below through specific implementation modes.

[0034] Such as figure 1 and 2 A heat-conducting gasket laminating machine is shown, including a frame 1, and a loading station, a grabbing station, and a winding station arranged on the frame. The feeding station is located behind the grabbing station. The winding station is located in front of the material grabbing station, and there are two loading stations, which are respectively located on the left and right sides of the material grabbing manipulator. In order to make the structural layout more compact and reasonable, the cross-section of the frame is square, the two feeding stations and the winding station are located on opposite sides of the square, and the grabbing station is located in the center of the square.

[0035] The grabbing station is provided with a grabbing manipulator 3 that moves the thermal pad 14 fr...

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PUM

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Abstract

The invention relates to a heat-conducting gasket film laminating machine and a film laminating method. The heat-conducting gasket film laminating machine comprises a rack, a feeding station, a grabbing station and a rolling station, the feeding station, the grabbing station and the rolling station are arranged on the rack, and the feeding station is provided with a feeding device and a power mechanism driving the feeding device to move close to the grabbing station; the feeding device comprises a supporting frame connected with the power mechanism and a pressing device arranged on the supporting frame. The grabbing station is provided with a grabbing manipulator for moving heat-conducting gaskets from the feeding device to the rolling station, and the grabbing end of the grabbing manipulator is provided with a suction cup; the rolling station is provided with a bottom film unrolling mechanism, a surface film unrolling mechanism and a rolling mechanism, a bottom film and a surface film are wound on the rolling mechanism after being unrolled, and a grabbing manipulator channel is arranged between the bottom film unrolling mechanism and the surface film unrolling mechanism. According to the heat-conducting gasket film laminating machine and the film laminating method, separation of a heat-conducting gasket and an original film body, movement of the heat-conducting gasket from the feeding station to the rolling station and laying of the bottom film and the surface film are achieved, and the production quality and the product quality are greatly improved.

Description

technical field [0001] The invention relates to the technical field of thermal pad packaging, in particular to a thermal pad coating machine and a coating method. Background technique [0002] Thermal pads are commonly used parts in electronic equipment. They are mainly used for heat dissipation of electronic devices. During the production of thermal pads, in order to improve production efficiency, a large sheet of pads is usually glued on the film body, and then The large gasket is cut into multiple small squares, and the small square-shaped thermal pads are not separated from the membrane body to avoid scattering. In order to ensure that the thermal pad is free from contamination during transportation, it needs to be removed from the membrane body and coated on both sides. At present, there is no equipment for coating thermal pads. Usually, the thermal pads are removed from the film body manually, and then the bottom film and the mask are used to protect the thermal pads....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B35/18B65B57/06B65B41/12B65B33/02B65B41/16
CPCB65B35/18B65B57/06B65B41/12B65B33/02B65B41/16
Inventor 巩合具高雪
Owner 页川智能科技山东有限公司