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FPC and PCB bonding electrical performance detection method

An electrical performance detection and integration technology, applied in the field of display production and testing, can solve the problems of heavy workload, easy misjudgment, inability to accurately detect the electrical performance of FPC and PCB bonding, and achieve high accuracy and detection. Convenience and simple effect

Pending Publication Date: 2021-11-02
SHENZHEN TXD TECH CO LTD
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  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

The number of bonding PINs of general products is about 300PINs, and the visual judgment method has the limitation of heavy workload and easy misjudgment, and cannot accurately detect the conduction performance of FPC and PCB bonding

Method used

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  • FPC and PCB bonding electrical performance detection method
  • FPC and PCB bonding electrical performance detection method
  • FPC and PCB bonding electrical performance detection method

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Embodiment Construction

[0027] The following is attached Figure 1-5 and specific embodiments, the present invention is described in detail.

[0028] The invention provides a method for detecting the electrical performance of FPC and PCB bonding, which specifically includes the following steps:

[0029] Step 1. Establish the engineering drawing of FPC bonding PIN, and design the first golden finger corresponding to the PIN number according to the glass specification. In this embodiment, the engineering drawing is established by EDA software. Several non-display function impedance test bonding PIN loops are arranged in the first gold finger, and the PIN loops electrically connect two adjacent first gold fingers, and each of the PIN loops passes through a metal wire f Connect two adjacent first golden fingers together. The metal wire f may be copper foil, which is only used for connection and conduction between the two first gold fingers, and has a small length and negligible resistance. Such as fi...

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Abstract

The invention discloses an FPC and PCB bonding electrical performance detection method, and the method comprises the following steps that an engineering drawing of FPC bonding PINs is established, and first golden fingers corresponding to the number of PINs are designed according to the specification of glass; a plurality of impedance test bonding PIN loops with a non-display function are arranged in the first golden fingers, and every two adjacent first golden fingers are electrically connected through the corresponding PIN loops; a PCB bonding PIN engineering drawing is established, the second golden fingers of the PCB bonding PIN correspond to the first golden fingers of the FPC bonding PIN in a one-to-one mode, and the two ends, corresponding to each impedance test bonding PIN loop, in the second golden fingers are each provided with a test bonding pad; the designed and produced FPC and PCB are bound; voltage is applied to the test bonding pad at one end of each impedance test bonding PIN loop by using a probe jig, and loop current I of the test bonding pad at the other end is tested; the resistance value of the single bonding PIN is calculated by R = V / I / 2 ; and whether the single bonding PIN is qualified or not is judged according to a calculation result.

Description

technical field [0001] The invention relates to the technical field of display screen production and detection, in particular to a detection method for bonding electrical properties of FPC and PCB. Background technique [0002] In the current liquid crystal display and touch screen industry, AOI (Automated Optical Inspection) is used to confirm the bonding effect of FPC and PCB, and then the number of gold ball particles and gold balls on each PIN are checked manually The burst state of the particle. The number of bonding PINs of a general product is about 300PINs, and the visual judgment method has the limitations of heavy workload and easy misjudgment, and cannot accurately detect the conduction performance of FPC and PCB bonding. [0003] Therefore, it is necessary to design a simple and accurate method for detecting the electrical performance of FPC and PCB bonding, so as to solve the above-mentioned problems in the prior art. Contents of the invention [0004] Aimin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/281G01R31/2818G01R31/2812
Inventor 田野曾小马黄平洋张丽霞
Owner SHENZHEN TXD TECH CO LTD
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