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Flexible circuit substrate and preparation method and application thereof

A technology for flexible circuit substrates and conductive layers, applied in the direction of circuit substrate materials, printed circuit manufacturing, printed circuits, etc., can solve the problems of increased equipment cost, difficulty in large-precision control, and increased cost of preparation processes, so as to improve the bonding strength and improve Peel strength and cost reduction effect

Active Publication Date: 2021-11-05
INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, a variety of factors lead to an increase in the cost of equipment under this production process, an increase in the cost of the preparation process, and the product yield is also limited due to the difficulty in precision control

Method used

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  • Flexible circuit substrate and preparation method and application thereof
  • Flexible circuit substrate and preparation method and application thereof
  • Flexible circuit substrate and preparation method and application thereof

Examples

Experimental program
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preparation example Construction

[0024] The preparation method of the flexible circuit substrate provided by the present invention comprises:

[0025] S1, providing a liquid crystal polymer film and a conductive layer, and performing surface activation treatment on at least one surface of the liquid crystal polymer film and at least one surface of the conductive layer under atmospheric pressure;

[0026] S2, the conductive layer after the surface activation treatment is laminated on at least one surface of the liquid crystal polymer film after the surface activation treatment, and the liquid crystal polymer film after the surface activation treatment The surface is bonded to the surface of the conductive layer after surface activation treatment, and subjected to cold pressing treatment to obtain a prefabricated board;

[0027] S3, performing heat and pressure treatment on the prefabricated board to obtain a flexible circuit substrate, wherein a transition connection layer is formed at the contact surface of t...

Embodiment 1

[0053] Provide a liquid crystal polymer film with a thickness of 35 μm, and perform plasma surface activation treatment on the liquid crystal polymer film at room temperature and atmospheric pressure, wherein the plasma gas is oxygen, the activation time is 100s, and the radio frequency power is 300W.

[0054] Provide a copper foil with a thickness of 25 μm, the surface roughness of the copper foil is 0.1 μm, and Rz is 0.95 μm. At room temperature and atmospheric pressure, the copper foil is subjected to plasma surface activation treatment, wherein the plasma gas is oxygen, and the activation time is 150s, the RF power is 100W.

[0055] On one surface of the copper foil after the surface activation treatment, the liquid crystal polymer film after the surface activation treatment is laminated, and cold pressing is carried out in a dust-free environment to obtain a prefabricated board, wherein the pressure is 0.1MPa, and the temperature is room temperature. The time is 30s.

[...

Embodiment 2

[0059] Provide a liquid crystal polymer film with a thickness of 35 μm, and perform plasma surface activation treatment on the liquid crystal polymer film at room temperature and atmospheric pressure, wherein the plasma gas is oxygen, the activation time is 100s, and the radio frequency power is 300W.

[0060] Provide a copper foil with a thickness of 25 μm, the surface roughness of the copper foil is 0.1 μm, and Rz is 0.95 μm. At room temperature and atmospheric pressure, the copper foil is subjected to plasma surface activation treatment, wherein the plasma gas is oxygen, and the activation time is 150s, the RF power is 100W.

[0061] On one surface of the copper foil after the surface activation treatment, the liquid crystal polymer film after the surface activation treatment is laminated, and cold press treatment is carried out in a dust-free environment to obtain a prefabricated board, wherein the pressure is 2.5MPa, and the temperature is room temperature. The time is 30...

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Abstract

The invention relates to a preparation method of a flexible circuit substrate. The preparation method comprises the following steps of providing a liquid crystal polymer film and a conductive layer, and respectively carrying out surface activation treatment on at least one surface of the liquid crystal polymer film and at least one surface of the conductive layer under atmospheric pressure; a conducting layer being arranged on the surface of the liquid crystal polymer film in a stacked mode, a surface, subjected to surface activation treatment, of the liquid crystal polymer film being attached to the surface, subjected to surface activation treatment, of the conducting layer, cold pressing treatment being conducted, and a prefabricated plate being obtained; and performing hot pressing treatment on the prefabricated plate to obtain the flexible circuit substrate, and forming a transition connection layer at a contact surface of the liquid crystal polymer film and the conductive layer in the flexible circuit substrate. The invention also relates to the flexible circuit substrate obtained by the preparation method and an application of the flexible circuit substrate in a printed circuit board. According to the preparation method of the flexible circuit substrate, the peel strength of the flexible circuit substrate can be further improved on the basis of reducing the cost.

Description

technical field [0001] The invention relates to the technical field of circuit substrates, in particular to a flexible circuit substrate and its preparation method and application. Background technique [0002] The traditional production method of liquid crystal polymer (LCP) thin film circuit substrate is mainly roll-to-roll (Roll to roll) high-temperature roller heat pressing, and it is one-time heat pressing forming. In this production method, the conductive layer such as copper foil and the LCP film are directly sent to the high temperature roller for hot pressing. high. [0003] In addition, in order to ensure the uniformity of the thickness of the circuit substrate, it has strict requirements on the temperature and pressure during the high-temperature roller bonding process, especially for the production of circuit substrates with an effective width greater than or equal to 500mm, not only the high-temperature roller is required The width should be at least 750mm, an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/38H05K1/03
CPCH05K3/381H05K3/382H05K1/036H05K1/0393H05K2201/0141H05K2203/061
Inventor 陈来成刘卫梦华聪聪
Owner INST OF FLEXIBLE ELECTRONICS TECH OF THU ZHEJIANG