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Fin structure, heat exchange tube and falling film evaporator

A technology of heat exchange tubes and fins is applied in the field of heat exchangers, which can solve the problems of unsatisfactory heat transfer efficiency of falling film evaporators, and achieve the effect of enhancing performance and enhancing heat transfer efficiency.

Pending Publication Date: 2021-11-09
GREE ELECTRIC APPLIANCES INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a fin structure, a heat exchange tube and a falling film evaporator, at least to solve the technical problem of unsatisfactory heat transfer efficiency of the falling film evaporator existing in the prior art

Method used

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  • Fin structure, heat exchange tube and falling film evaporator
  • Fin structure, heat exchange tube and falling film evaporator
  • Fin structure, heat exchange tube and falling film evaporator

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Embodiment 1

[0034] The invention provides a fin structure, including an evaporation chamber, a transient heat conduction enhancement structure and a flow channel, the evaporation chamber is formed between the top and the bottom of the fin, the flow channel communicates with the evaporation chamber, and the transient heat conduction enhancement structure is formed At the bottom of the fins, the transient heat conduction of the heat exchange tube can be enhanced.

[0035] When the fin structure is set on the outer surface of the heat exchange tube, the transient heat conduction will occur in the area where the transient heat conduction strengthening structure is in contact with the heat exchange tube, which enhances the heat transfer efficiency of the transient heat conduction process, thus enhancing the heat transfer efficiency. Performance of heat pipes and falling film evaporators.

[0036] Specifically, such as Figure 1-Figure 4 As shown, the transient heat conduction enhancing struct...

Embodiment 2

[0045] Such as Figure 1-Figure 5 As shown, the present invention also provides a heat exchange tube, which includes a tube body and any one of the above fin structures, and the fin structure is formed on the outer surface of the tube body.

[0046] As an optional implementation, such as figure 1 and Figure 5 As shown, the top of the fin is provided with a fin cap, and the fin cap is provided with an axial stripe rib 5 . The axial stripes on the wing top cover increase the axial surface tension and elongate the liquid film, thereby strengthening the axial film distribution.

[0047] As an optional embodiment, the bubble escape port 4 of the evaporation chamber is formed on the fin top cover. The finned top cover can trap a small amount of gas, leaving a gasification core in the evaporation chamber after the bubbles leave, reducing the time for the next bubble growth.

Embodiment 3

[0049] The specific embodiment of the present invention provides a falling film heat exchange tube, which includes a tube body and a fin structure on the outside of the tube body, and the root of the fin is connected with the tube body as a whole. Such as figure 1As shown, the falling film heat exchange tube fin includes a gasification core generation area 1 , annular shallow ribs 2 , intersecting flow channels 3 , bubble escape ports 4 in the evaporation chamber, and axial stripe ribs 5 . Wherein, the base of the fins is composed of closely arranged hexagons, and each hexagon is an independent evaporation chamber. The middle section of each side of the hexagon has a flow channel, so that the flow channel becomes a staggered flow channel 3 . Each hexagon has a gasification core area in the center, which is conical in shape, with a depth of H1 and a diameter of H3. With the apex of the gasification core area as the center, annular shallow ribs 2 are arranged to enhance transi...

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Abstract

The invention provides a fin structure, a heat exchange tube and a falling film evaporator, and relates to the technical field of heat exchangers. The fin structure, the heat exchange tube and the falling film evaporator solve the technical problem that the heat transfer efficiency of an existing falling film evaporator is not ideal. The fin structure comprises an evaporation cavity, a transient heat conduction strengthening structure and a flow channel, wherein the evaporation cavity is formed between the top and the bottom of a fin, the flow channel communicates with the evaporation cavity, and the transient heat conduction strengthening structure is formed at the bottom of the fin. When the fin structure is arranged on the outer surface of the heat exchange tube, transient heat conduction can occur in the area where the transient heat conduction strengthening structure making contact with the heat exchange tube for heat transfer is located, the heat transfer efficiency in the transient heat conduction process is strengthened, and therefore the performance of the heat exchange tube and the performance of the falling film evaporator are strengthened.

Description

technical field [0001] The invention relates to the technical field of heat exchangers, in particular to a fin structure, a heat exchange tube and a falling film evaporator. Background technique [0002] As a new type of high-efficiency energy-saving equipment, the horizontal tube falling film evaporator is gradually replacing the flooded evaporator with its advantages of small refrigerant charge, small hydrostatic pressure difference, high heat transfer efficiency and convenient oil return. [0003] Transient heat conduction is a sub-process in the boiling heat transfer process. When the bubbles just leave the heat exchange surface, a large amount of supercooled liquid fills the position of the original bubbles and conducts transient heat conduction with the heating surface. Existing literature shows that the heat transfer amount of transient heat conduction accounts for more than 35% of the total boiling heat transfer. In the horizontal tube falling film evaporation proc...

Claims

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Application Information

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IPC IPC(8): F28F1/12F25B39/02
CPCF28F1/12F25B39/02F25B2339/021
Inventor 卢杏斌胡东兵胡海利王小勇
Owner GREE ELECTRIC APPLIANCES INC
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