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Method of determining a set of metrology points on a substrate, associated apparatus and computer program

A technology of measuring points and collections, which is used in measuring devices, photolithographic process exposure devices, opto-mechanical equipment, etc.

Pending Publication Date: 2021-11-09
ASML NETHERLANDS BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This results in a sampling scheme that is suboptimal

Method used

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  • Method of determining a set of metrology points on a substrate, associated apparatus and computer program
  • Method of determining a set of metrology points on a substrate, associated apparatus and computer program
  • Method of determining a set of metrology points on a substrate, associated apparatus and computer program

Examples

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Embodiment Construction

[0020] figure 1 A lithographic apparatus LA according to an embodiment of the invention is schematically depicted.

[0021] The unit includes:

[0022] - an illumination system (illuminator) IL configured to condition a radiation beam B (eg UV radiation or EUV radiation).

[0023] - a support structure (e.g. a mask table) MT configured to support a patterning device (e.g. a mask) MA and connected to a first positioner PM configured to accurately position the patterned device according to certain parameters equipment;

[0024] - a substrate table (e.g. a wafer table) WTa or WTb configured to hold a substrate (e.g. a resist-coated wafer) W and connected to a second positioner PW configured to Accurately position the substrate according to specific parameters; and

[0025] - A projection system (eg a refractive projection lens system) PS configured to project the pattern imparted to the radiation beam B by the patterning device MA onto a target portion C of the substrate W (...

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PUM

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Abstract

A method of determining a set of metrology point locations, said set comprising a subset of potential metrology point locations on a substrate; wherein said method comprises: determining a relation between noise distributions associated with a plurality of said potential metrology point locations using existing knowledge; and using the determined relation and a model associated with said substrate to determine the set.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to EP application 19164831.0, filed 25 March 2019, and EP application 19170764.5, filed 24 April 2019, the entire contents of which are incorporated herein by reference. technical field [0003] The present invention relates to a method of determining a set of metrology points on a substrate, an associated device and a computer program. Background technique [0004] A lithographic apparatus is a machine that applies a desired pattern to a substrate, usually a target portion of the substrate. A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In this instance, a patterning device, alternatively referred to as a mask or reticle, may be used to generate a circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg, including a portion thereof, one or more dies) on a substrate (...

Claims

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Application Information

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IPC IPC(8): G03F7/20G01N21/47G01N21/95
CPCG03F7/70616G03F9/7046G01N21/956G01N21/47G03F7/70633G03F7/7085
Inventor K·范德鲁伊特R·沃克曼J·S·维尔登贝尔格
Owner ASML NETHERLANDS BV