Thermopile sensor integrated with CMOS circuit and manufacturing method of thermopile sensor

Abstract

The invention discloses a thermopile sensor integrated with a CMOS circuit in the technical field of sensors, which comprises a tube socket, a tube cap, a photosensitive element, a pin, an optical filter and a light-transmitting groove, and is characterized in that the photosensitive element comprises a substrate, an insulating layer, thermocouple layers, a heat-conducting layer and a supporting part, the insulating layer is arranged on the substrate, the thermocouple layers are symmetrically arranged on the upper surface of the insulating layer along the center line of the insulating layer, a gap is formed between the end parts of the thermocouple layers on the two opposite sides of the insulating layer, and a heat conduction groove is formed in the insulating layer. The heat conduction layer can be supported by arranging the supporting part, a thermocouple can be timely cooled by arranging the heat conduction groove, the light receiving range of the optical filter can be enlarged by arranging a light gathering cover, the light receiving efficiency of the photosensitive element can be improved, the angle of the optical filter can be adjusted by arranging the driving unit to drive the clamping seat to turn over up and down, therefore, the light refraction angle of the optical filter is adjusted, and the light receiving precision of the photosensitive element is improved.

Description

technical field [0001] The invention relates to the technical field of sensors, in particular to a thermopile sensor integrating a CMOS circuit and a manufacturing method thereof. Background technique [0002] A thermopile is a pyrolytic infrared sensor, which is a device composed of thermocouples. It has been widely used as a temperature detection device in ear thermometers, radiation thermometers, electric ovens, food temperature detection and other fields. [0003] The rigidity of the heat conduction layer on the current thermocouple sensor is poor, which makes the heat conduction layer vulnerable to extrusion damage. In addition, the heat on the thermocouple cannot be evacuated in time, so that the accumulation of heat is easy to cause low detection accuracy of the thermocouple. [0004] Based on this, the present invention designs a thermopile sensor with integrated CMOS circuit and its manufacturing method to solve the above problems. Contents of the invention [0...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a thermopile sensor with an integrated CMOS circuit and its manufacturing method, to solve the problem that the rigidity of the thermal conduction layer on the current thermocouple sensor proposed in the above-mentioned background technology is relatively poor, thereby making the thermal conduction layer vulnerable to extrusion damage , In addition, the heat on the thermocouple cannot be evacuated in time, so that the accumulation of heat is easy to cause the problem of low detection accuracy of the thermocouple

Images