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High-frequency module and communication device

A high-frequency module, communication frequency band technology, applied in the separation device of transmission path, digital transmission system, time-division multiplexing usage, etc., can solve the problems of increased transmission loss and inability to ensure isolation.

Active Publication Date: 2021-11-12
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the case of transmitting high-frequency signals in these wide-band communication bands for TDD, there is a problem that the signal path for transmitting high-frequency signals in the communication band and the transmission of high-frequency signals in the communication band close to the communication band cannot be ensured. Signal isolation between signal paths, transmission loss increases

Method used

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  • High-frequency module and communication device
  • High-frequency module and communication device
  • High-frequency module and communication device

Examples

Experimental program
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Embodiment approach 1

[0034] [1.1 Structure of high-frequency module 1 and communication device 6]

[0035] figure 1 It is a circuit configuration diagram of the high-frequency module 1 and the communication device 6 according to the first embodiment. As shown in the figure, the communication device 6 includes a high-frequency module 1 , antennas 2A and 2B, and an RF signal processing circuit (RFIC) 3 .

[0036] RFIC 3 is an example of an RF signal processing circuit that processes high-frequency signals transmitted and received by antennas 2A and 2B. Specifically, the RFIC 3 performs signal processing on the received signal input via the high-frequency module 1 by down-conversion or the like, and outputs the received signal generated after the signal processing to a baseband signal processing circuit (BBIC: not shown). In addition, the RFIC 3 outputs a transmission signal processed based on a signal input from the BBIC to the high frequency module 1 .

[0037] The antenna 2A is connected to the...

Embodiment approach 2

[0075] The high-frequency module according to the first embodiment has a structure in which the high-frequency circuits 10 and 20 are connected to different antennas, but the high-frequency module according to the present embodiment has a structure in which the high-frequency circuits 10 and 20 are connected to the same antenna 2 .

[0076] [2.1 Structure of High Frequency Module 1A]

[0077] Figure 4 It is a circuit configuration diagram of the high-frequency module 1A and the antenna module 5A according to the second embodiment.

[0078] The antenna module 5A includes the antenna 2 and the high-frequency module 1A. The antenna module 5A according to the present embodiment differs from the antenna module 5 according to the first embodiment in that one antenna 2 is disposed and that the high-frequency module 1A includes a switch 40 . Hereinafter, regarding the antenna module 5A and the high-frequency module 1A according to the present embodiment, the description of the sam...

Embodiment approach 3

[0097]The high-frequency modules according to Embodiments 1 and 2 have a circuit configuration for transmitting signals in the first to third communication frequency bands, but the high-frequency module according to this embodiment has a circuit configuration for transmitting signals in the fourth communication frequency band. The structure of the circuit.

[0098] Figure 5 It is a circuit configuration diagram of the high-frequency module 1B and the antenna module 5B according to the third embodiment.

[0099] Antenna module 5B includes antennas 2A and 2B and high frequency module 1B. The antenna module 5B according to the present embodiment differs from the antenna module 5 according to the first embodiment in the circuit configuration of the high-frequency circuit 20B included in the high-frequency module 1B. Hereinafter, regarding the antenna module 5B and the high-frequency module 1B according to the present embodiment, the description of the same points as those of th...

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Abstract

The invention provides a high-frequency module and a communication device. The high-frequency module (1) includes: a first antenna connection terminal (100); a second antenna connection terminal (200) different from the first antenna connection terminal (100); a first filter (11) having a passband of a first frequency range including a first communication band allocated as a TDD communication band; a second filter (12) having a passband of a second frequency range including a second communication band allocated as a TDD communication band; and a third filter (21) having a passband of a third frequency range including a third communication band allocated as a TDD communication band. The third frequency range is located between the first frequency range and the second frequency range. The first and second filters (11 and 12) are both connected to one of the first antenna connection terminal and the second antenna connection terminal (100 and 200). The third filter (21) is connected to the other of the first antenna connection terminal and the second antenna connection terminal (100 and 200).

Description

technical field [0001] The invention relates to a high-frequency module and a communication device. Background technique [0002] In communication services in recent years, for the purpose of increasing communication capacity and speed, broadbanding of communication frequency bands and simultaneous use of a plurality of communication frequency bands have been implemented. [0003] Patent Document 1 discloses a multiplexer capable of demultiplexing and multiplexing high-frequency signals in two different communication frequency bands. The multiplexer disclosed in Patent Document 1 is composed of an LC filter including inductors and capacitors. Accordingly, it is possible to perform demultiplexing and multiplexing of a high-frequency signal in a wideband communication frequency band. [0004] prior art literature [0005] patent documents [0006] Patent Document 1: Japanese Patent Laid-Open No. 2006-128881 Contents of the invention [0007] The problem to be solved by ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B1/40
CPCH04B1/40H04L5/1469H04B1/0064H04B1/0057H04L5/26H04L5/0005
Inventor 森弘嗣
Owner MURATA MFG CO LTD