Manufacturing process of LED lamp strip circuit board
A technology of LED light strip and manufacturing process, which is applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., can solve the problems of unreliable electrical connection, large environmental pollution, high manufacturing cost, etc., and achieve reduction of circuit corrosion process and small environmental pollution , the effect of low production cost
Inactive Publication Date: 2021-11-12
江门市鼎峰照明电子科技有限公司
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Problems solved by technology
In the manufacture of circuit boards in the prior art, due to the need to carry out wet etching twice on the circuit substrate, the process is complicated, the manufacturing cost is high and the environment is polluted; Two times of electroplating in the hole, the process is complicated and the electrical connection is unreliable; when connecting the external power supply, it is necessary to weld the wire terminal on the connection circuit, the process is complicated and the electrical connection is not reliable
Method used
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[0016] In order to further understand the features, technical means, specific objectives and functions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0017] refer to figure 1 and figure 2 . A double-sided circuit board substrate for LED light strips, including an insulating substrate 1, a conductive layer 2 covering the substrate 1 is adhered on one side of the substrate 1, and a circuit board is adhered on the other side. A plurality of conductive strips 3 of the power circuit. A first isolation area S1 is provided between the plurality of conductive strips 3 , and a second isolation area S2 is provided between the edge of the substrate 1 and the conductive strip 3 closest to the edge of the substrate 1 . Since the thickness of the substrate 1 is relatively thin, setting the second isolation region S2 can prevent short circuit or creepage between the conduc...
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The invention provides a manufacturing process of an LED lamp strip circuit board. The process comprises the steps: manufacturingan insulating substrate; adhering a conductive layer on one side of the substrate, and forming a plurality of conductive strips at intervals on the other side of the substrate; printing anti-corrosion ink on the conductive layer according to a circuit pattern; etching the part, which is not covered by the anti-corrosion ink, on the conductive layer by using a corrosion liquid agent, so that the part, which is not corroded, on the conductive layer forms a connecting circuit; printing a solder resist ink layer on the connecting circuit, reserving a first bonding pad for exposing the connecting circuit at the position where the LED lamp beads and other electronic components need to be welded, and reserving a second bonding pad at the position where the connecting circuit and the conductive strip need to be conducted; forming a communicating hole in the second bonding pad; and finally, inserting a metal rod into the communicating hole, and upsetting the two ends of the metal rod on the upper side and the lower side of a base material in a stamping or extruding manner, so that the two ends of the metal rod are respectively clamped on the connecting circuit and the conductive layer.
Description
technical field [0001] The invention relates to a circuit board manufacturing process, and specifically discloses a circuit board manufacturing process for an LED light strip. Background technique [0002] The manufacturing process of the existing lead-free LED light strip includes: first, select the circuit board base material with copper foil attached on both sides, and then make the connection circuit connecting the LED lamp beads on one side of the copper foil by wet etching, and then On the other side of the copper foil, make a power supply circuit for conductive power supply through the second wet etching; then, start a via hole at the place where the connecting circuit and the power supply circuit need to be electrically connected; then; electroplate a palladium metal layer on the inner wall of the via hole As a transition layer, electroplate the copper metal layer connecting the connection circuit and the power circuit on the palladium metal layer; then, cover the so...
Claims
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IPC IPC(8): H05K3/12H05K3/40
CPCH05K3/12H05K3/4046
Inventor 赖思强
Owner 江门市鼎峰照明电子科技有限公司